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an accelerometer

An accelerometer and substrate technology, which is applied in the direction of measuring acceleration, velocity/acceleration/shock measurement, and measuring devices, can solve the problems of thermal stress on device performance, reduce the impact of thermal stress on electrode structure, and ensure symmetry Sexuality, the effect of reducing the impact

Active Publication Date: 2018-02-27
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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Problems solved by technology

[0005] The present invention aims to solve the problem of the influence of thermal stress on device performance caused by temperature changes in the existing Z-axis capacitive MEMS accelerometer, and provides an accelerometer that can reduce the influence of thermal stress on the device, using MEMS bulk silicon technology, processing The process is simple, the reliability and consistency of the product are good, and batch manufacturing can be realized

Method used

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Embodiment Construction

[0025] The structure of the present invention will be further described below in conjunction with the accompanying drawings.

[0026] Low stress capacitive MEMS accelerometer structure

[0027] refer to figure 1 , figure 2 , image 3 , a kind of accelerometer structure of the present invention is divided into 4 layers altogether, is respectively substrate layer 13, electrode structure layer 1, movable structure layer 15 and cap 14, and above-mentioned substrate layer, electrode structure layer, movable structure layer and cap are all Made of silicon material.

[0028] Described below:

[0029] a. The substrate 13, the shallow cavity 2 and the substrate anchor point 5 are provided in the middle of the substrate 13, and the bottom surface of the shallow cavity 2 in the substrate 13 is provided with a set of anti-overload and anti-adhesion lower bumps 12 corresponding to the suspension electrodes 4, A silicon dioxide oxide layer 9 is provided on the substrate;

[0030] b. ...

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Abstract

The invention relates to an accelerometer, comprising: a. a shallow cavity (2) and a substrate anchor point (5) in a substrate (13); b. a central anchor point ( 16), at least one floating electrode (4) is symmetrically arranged on both sides of the central anchor point (16), and the floating electrode (4) is matched with the shallow cavity (2) below, and the upper surface of the floating electrode (4) is provided with an upward The movable gap (11); c. The movable structure layer (15), and the movable structure (10) provided therein, in which the upper anchor point (18) and the central anchor point (16) are correspondingly bonded and connected; d. Cap (14). The invention has the following advantages: the influence of thermal stress on the electrode structure is greatly reduced, so that the electrode structure has almost no deformation in the full temperature range, thereby ensuring the symmetry of the capacitance on the left and right sides of the device in the full temperature range, and improving the full temperature performance of the sensor .

Description

technical field [0001] The invention belongs to the technical field of micro-mechanical electronics, in particular to an accelerometer. Background technique [0002] The development of MEMS has greatly promoted the progress of sensor technology and realized the miniaturization of acceleration sensors. There are various forms such as capacitive, piezoelectric, piezoresistive, thermal convection, tunnel current and resonance. Capacitive accelerometers manufactured by micromachining technology have unique advantages in measurement accuracy, temperature characteristics, closed-loop measurement and self-inspection using electrostatic force, and easy integration with electronic circuits. They can be widely used in aerospace, oil exploration, Seismic monitoring, medical equipment and many other fields have broad market application scenarios. [0003] The microstructure of a capacitive MEMS accelerometer usually includes a sensitive structure as well as an electrode structure. Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/125
Inventor 王鹏郭群英黄斌曹卫达何凯旋段宝明
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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