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chip integration method

An integration method and chip technology, applied in the manufacture of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of large integrated system, difficult heterogeneous integration of tuning fork quartz gyro chips and ASIC chips, and low integration. , to solve technical problems, improve integration, and improve the effect of integration

Active Publication Date: 2018-02-13
NO 24 RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a chip integration method, which is used to solve the technical problem of difficult heterogeneous integration of the tuning fork quartz gyroscope chip and the ASIC chip in the prior art, and avoids the construction of traditional integration methods. The problem of large volume and low integration level of the integrated system

Method used

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Embodiment 1

[0029] see figure 1 , is a flow chart of a chip integration method in an embodiment of the present invention, and is suitable for integrating a tuning fork quartz gyro chip 14 and an ASIC chip, and the chip integration method at least includes:

[0030] S1, providing a substrate 9, and making the substrate 9 into an LTCC substrate with a preset specification shape and inner cavity 7;

[0031] Among them, the ASIC chip (Application Specific Integrated Circuit, application-specific integrated circuit) is an integrated circuit designed for a special purpose, and the LTCC substrate is a substrate obtained by using (low Temperature Co-fired Ceramic, low temperature co-fired ceramic) technology.

[0032] The preset specifications of the LTCC substrate are as follows: the substrate 9 is manufactured with 20 layers, the external dimensions are 16mm×14mm×2mm, and the inner cavity 7 is 13mm×4mm×1mm.

[0033] S2, then making tin-lead eutectic solder bumps on the front side of the ASIC c...

Embodiment 2

[0043] see Figure 2 to Figure 7 , is shown as a schematic diagram of the structure of the tuning fork quartz gyro chip 14 and a schematic diagram of the structure of the LTCC substrate in the embodiment of the present invention. The size of the ceramic sheet is 150mm×150mm×0.133mm, and the thickness of each layer of green ceramic sheet after lamination and sintering is about 0.1mm, and 20 layers of the green ceramic sheet are processed; the depth of the LTCC substrate cavity is 1mm, from The first layer to the twentieth layer are stacked in sequence from bottom to top, and the green ceramic sheets of the eleventh layer to the twentieth layer are subjected to the inner cavity 7 treatment, and the inner cavity 7 holes 2 with a size of 13mm×4mm are made, and the first The green ceramic sheets from the first to the tenth layers only need to be stacked to make LTCC matrix materials.

[0044] Wherein, the production process of the preset specifications of the LTCC substrate is des...

Embodiment 3

[0055] S1.1, if image 3 As shown, a green ceramic sheet with a size of 150mm×150mm×0.133mm is selected, and the 11th layer of green ceramic sheet is punched to form an inner cavity with a size of 13mm×4mm and 7 holes 2. The surface of the ceramic sheet is printed with silver conduction band 1 paste, the width of silver conduction band 1 is 150 μm, the thickness is 8 um, and the silver conduction band 1 paste is baked at 85 ° C;

[0056] S1.2, printing the gold paste of the gold bonding area 3 on the surface of the 11th green ceramic sheet, the size of the gold bonding area 3 is 250 μm×500 μm, and baking the gold paste at 85° C.;

[0057] S1.3, if Figure 4 As shown, a through hole 4 with a diameter of 125 μm and an inner cavity 7 holes 2 with a size of 13 mm×4 mm were made on the 12th to 20th layer of green ceramic sheets;

[0058] S1.4, if Figure 5 As shown, the through hole 4 is filled with the through hole 4 paste, and the gold paste is baked at 85° C.;

[0059] S1.5,...

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Abstract

The invention provides a chip integration method and is applied to integration of a tuning fork quartz gyro chip and an ASIC chip. The method comprises the following steps: S1, providing a substrate, and manufacturing the substrate into an LTCC substrate which has a preset specification profile and comprises an inner cavity; S2, then preparing tin-lead eutectic solder bumps on the front surface of the ASIC chip; S3, bonding the tuning fork quartz gyro chip to the inner cavity of the LTCC substrate; S4, welding a lead wire between the electrode of the tuning fork quartz gyro chip and the substrate; and S5, according to the tin-lead eutectic solder bumps, welding the ASIC chip and the LTCC substrate in a flip-chip mode. According to the invention, the tuning fork quartz gyro chip is integrated in the inner cavity of the multilayer LTCC substrate, the solder bumps are prepared at the front surface of the ASIC chip, and the solder bumps are arranged on the multilayer LTCC substrate of the tuning fork quartz gyro chip in a flip-chip mode, such that the volume of a whole system is reduced, the integration of the whole system is improved, requirements of a navigation system for miniaturization, high integration and light duty are met, and the problem of difficult heterogeneous integration of the tuning fork quartz gyro chip and the ASIC chip is solved.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to an integration method of a tuning fork quartz gyro chip and an ASIC chip, wherein it also relates to a heterogeneous integration method of a tuning fork quartz gyro system, and the tuning fork quartz gyro system is applied to inertial integrated navigation field of microsystems. Background technique [0002] Tuning fork quartz gyroscopes can be used for positioning, attitude control and absolute direction measurement, and are widely used in military, automotive, medical and communication fields, especially in satellite communication antennas, missile guidance, aircraft, missile flight control, GPS navigation systems and other fields. Broad application prospects. [0003] At present, the base material of the tuning fork quartz gyroscope chip is quartz, the base material of the ASIC chip is silicon, and the shape of the tuning fork quartz gyroscope chip is H-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L2224/48091H01L2224/73265
Inventor 张志红李勇健林丙涛徐全吉杨镓溢
Owner NO 24 RES INST OF CETC