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A kind of room temperature storage rapid flow underfill glue and preparation method thereof

A technology of underfill glue and room temperature, applied in adhesives, epoxy glue, non-polymer adhesive additives, etc., can solve problems such as energy waste, poor stability, and slow fluidity, so as to improve production efficiency and protect chips and solder joints, the effect of speeding up the production cycle

Active Publication Date: 2019-07-26
YANTAI JIUBANG NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional epoxy underfill, due to its high viscosity and slow fluidity, cannot meet the production pace of today's electronic products; at the same time, the poor stability requires low temperature storage and the substrate needs to be preheated during glue application, which will cause energy waste.

Method used

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  • A kind of room temperature storage rapid flow underfill glue and preparation method thereof
  • A kind of room temperature storage rapid flow underfill glue and preparation method thereof
  • A kind of room temperature storage rapid flow underfill glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Weigh raw materials according to the following parts by mass

[0017]

[0018] First add epoxy resin 830lvp, HP4032D, toughening agent PB3600, fumaric acid, wetting and dispersing agent W-980 into the stirring container, stir under vacuum until the fumaric acid is completely dissolved, and then add the latent curing agent For MY-25, stir in vacuum for 60 minutes, finally add active diluent p-tert-butylphenyl glycidyl ether and stir evenly, then vacuum and stir for 120 minutes before discharging.

Embodiment 2

[0020] Weigh raw materials according to the following parts by mass

[0021]

[0022] First add epoxy resin YL983U, HP4032D, toughening agent PB4700, terephthalic acid, wetting and dispersing agent W-985 into the stirring container, stir under vacuum until the terephthalic acid is completely dissolved, and then add the latent Curing agent PN-50, vacuum stirring for 60min, finally add reactive diluent resorcinol diglycidyl ether and stir evenly, then vacuumize and stir for 120min before discharging.

Embodiment 3

[0024] Weigh raw materials according to the following parts by mass

[0025]

[0026]

[0027] First add epoxy resin YL983U, HP4032D, toughening agent PB3600, itaconic acid, wetting and dispersing agent W-966 into the stirring container, stir under vacuum until the itaconic acid is completely dissolved, and then add the latent curing agent For FXR1030 and EH-4360S, stir in vacuum for 60 minutes, and finally add reactive diluent p-tert-butylphenyl glycidyl ether and stir evenly, then vacuum and stir for 120 minutes before discharging.

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PUM

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Abstract

The invention relates to quick-flowing bottom filling adhesive stored at the room temperature and a preparing method the quick-flowing bottom filling adhesive. The quick-flowing bottom filling adhesive is prepared from, by mass, 30-60 parts of liquid epoxy resin, 1-10 parts of toughening agents, 5-20 parts of reactive diluent, 0.5-3 parts of stabilizer, 10-40 parts of latent curing agents and 0.1-2 parts of wetting dispersant. The raw materials are added into a stirring container and evenly stirred in a vacuum state, and the bottom filling adhesive is obtained after the materials are discharged. The prepared bottom filling adhesive has good storage stability, high flowing speed, good flexibility and the like and is suitable for encapsulation and protection of consumer electron BGA chips.

Description

technical field [0001] The invention belongs to the field of electronic adhesives, and in particular relates to a fast-flowing underfill glue stored at room temperature and a preparation method thereof. Background technique [0002] The underfill glue is a kind of filling that penetrates into the bottom of the BGA chip through capillary phenomenon, and is cured by heating, thereby reducing the stress on the solder joints and chips, protecting the chips and solder joints, and prolonging their service life. With the acceleration of the replacement of consumer electronic products and the development trend of high-performance and multi-functional electronic components, higher requirements are put forward for the adhesive used in flip chips. However, the traditional epoxy underfill, due to its high viscosity and slow fluidity, cannot meet the production pace of today's electronic products; at the same time, its poor stability requires low temperature storage and the substrate nee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/08
Inventor 徐胜广王月玲
Owner YANTAI JIUBANG NEW MATERIAL TECH CO LTD