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Sandwich panel and method of making the same

A manufacturing method and panel technology, applied in the direction of multi-layer circuit manufacturing, printed circuit components, etc., can solve the problems of failure to pass the reliability test, reduce product yield, metal wire damage, etc., so as to reduce the risk of damage to the metal wire, The effect of improving production efficiency and improving yield

Active Publication Date: 2019-01-22
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above existing problems, the present invention discloses a sandwich panel and its manufacturing method, so as to overcome the problem in the prior art that the metal wires are easily damaged during the panel cutting process, thus causing the failure of the reliability test and reducing the product yield.

Method used

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  • Sandwich panel and method of making the same
  • Sandwich panel and method of making the same

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Embodiment Construction

[0048] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0049] A first embodiment of the invention relates to a sandwich panel such as Figure 3-5 shown, including:

[0050] bottom substrate 1;

[0051]Several metal wires 3 extend along the first direction and are arranged parallel to each other on the bottom substrate 1, and any metal wire 3 is arranged along the second direction (the second direction is perpendicular to the above-mentioned bottom substrate 1). surface, and at the same time perpendicular to the above-mentioned first direction) has a first thickness, and the number of metal lines 3 can be provided with N, wherein N is a natural number, such as N=4 (the specific number can be set according to process requirements set), etc.;

[0052] A plurality of spacers 5 extend along the above-mentioned first direction on the bottom substrate 1...

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PUM

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Abstract

The invention discloses a sandwich panel, which comprises a bottom substrate, a plurality of metal wires, a plurality of spacer pads, a top substrate and a notch, wherein the metal wires are arranged on the bottom substrate and are arranged in parallel; the plurality of spacer pads are arranged on the bottom substrate; the spacer pads are separated from the metal wires; the thickness of each spacer pad is greater than that of each metal wire; the top substrate is laminated on the bottom substrate; when the top substrate is laminated on the bottom substrate, the top substrate is separated from the metal wires on the bottom substrate thorough the spacer pads; the notch is formed in one side edge of the top substrate; and at least partial metal wires and spacer pads are exposed from the notch. The invention further discloses a manufacturing method of the sandwich panel. According to the sandwich panel, the risk of damaging the metal wires in a panel cutting process is effectively reduced; exposing of the metal wires is avoided; the metal wires are not easily corroded; a reliability test is relatively easy to pass; and the yield of a product is greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a panel cutting process, in particular to a sandwich panel and a manufacturing method thereof, which can effectively reduce the damage of metal wires in the panel cutting process. Background technique [0002] At present, the panel is easy to cause damage to the metal wire during the cutting process, but the slight damage is difficult to detect during the lighting test, which will cause the subsequent reliability test to fail. If the metal wire damage cannot be effectively prevented, the reliability of the panel is difficult to obtain an effective measure. promote. The panel cutting process generally includes two aspects, one is the cutting process, and the other is the process of stripping off residual materials. Such as figure 1 and figure 2 As shown, 4 is the damage position of the metal wire. In the current process of cutting the panel, when the cuttin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/46
Inventor 王俊閔
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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