Surface Stacked Image Sensor

Abstract

The invention discloses a curved surface stacked-type image sensor, wherein a thin flexible stacked-type image sensor main body is adopted and a seal pipe with an inner curved surface is combined; a lower silicon sheet is bonded with the inner curved surface, so as to make the bottom of the lower silicon sheet bent into corresponding arc degree with the inner curved surface, thereby reducing the volume of the whole stacked-type image sensor; in addition, a piece of light-transmitting glass is used to seal a top portion; the piece of the light-transmitting glass and the top portion of an upper silicon sheet are provided with empty cavities; each empty cavity is filled with inert air; a side wall of each empty cavity is provided with a micro through hole; in the ground environment, the inert air can protect the clearness of the stacked-type image sensor main body; when the outside atmospheric pressure changes, the inert air inside each empty cavity can be exhausted from the micro through hole to the outside or the outside air can enter each empty cavity from the micro through hole, thereby the air pressure inside each empty cavity and the outside air pressure are identical or mostly the same; and no matter in the ground environment or the space environment, the problem that the curved surface stacked-type image sensor explodes or the curved surface stacked-type image sensor is squished can be prevented.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a curved surface stacked image sensor. Background technique [0002] Image sensors are an important part of digital cameras. According to the different components, it can be divided into two categories: CCD (Charge Coupled Device, charge-coupled device) and CMOS (Complementary Metal-Oxide Semiconductor, metal oxide semiconductor device). A prerequisite for the wide application of CMOS sensors is their higher sensitivity, shorter exposure time and shrinking pixel size. [0003] In order to achieve a higher level of integration, a new technology has emerged as the times require, that is, the stacked image sensor. The usual stacked image sensor consists of upper and lower parts. The upper part is a BSI silicon chip, and the lower part is a traditional silicon chip. A highly integrated stacked image sensor can reduce the size of the image sensor. [0004] Space exploration ...

AI Technical Summary

Problems solved by technology

However, the environment of space is different from that of the earth, and space is in a high vacuum state. The above-mentioned stacked image sensor in space will burst or explode, making the stacked image sensor unable to be applied in space.

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