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Curable composition and electronic component

A technology of curable composition and electronic components, applied in non-polymer organic compound adhesives, conductive adhesives, adhesive additives, etc., can solve the problems of inability to cure solder paste and unsatisfactory bonding strength. , to achieve the effect of excellent bonding strength

Active Publication Date: 2019-05-14
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the other hand, low-melting-point solder is used to enable conductive connection at low temperature, and a technique of a conductive adhesive that uses epoxy resin to enhance the bonding strength of low-melting-point solder has been proposed (Patent Document 1), however , in this prior art, there is a problem that the solder paste cannot be solidified in a short time
[0004] On the other hand, as a technique for curing a low-melting point solder paste in a short period of time, a conductive adhesive has been disclosed to process at a high temperature (Patent Document 2). Contact strength
[0005] As such, the reality is that no technology has been proposed to enable conductive connection with excellent adhesive strength at low temperature, low pressure, and short time with a conductive adhesive such as solder paste.

Method used

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  • Curable composition and electronic component
  • Curable composition and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8

[0113] (Examples 1 to 8, and Comparative Example 1)

[0114] I. Preparation of curable composition

[0115] Each component was mixed and stirred at the compounding ratio (mass ratio) shown in Table 1, and the curable composition of Examples 1-8 and Comparative Example 1 was prepared.

[0116] II. Evaluation of Adhesive Strength

[0117] II-1. Preparation of test piece

[0118] (1) Rigid substrate (copper substrate)

[0119] The curable compositions of Examples 1 to 8 and Comparative Example 1 prepared in the aforementioned I were coated on a rigid substrate (substrate: FR-4, pad width: 100μm, pitch width: 0.2mm, Au flash plating treatment). Next, a flexible substrate (width: 16 mm, base material: polyimide, pad width: 100 μm, pitch width: 0.2 mm, Au flash plating treatment) was placed on the rigid substrate in the state where the curable composition was applied . This placement was performed by aligning the pads of the rigid substrate and the pads of the flexible substra...

Embodiment 9～16、 and comparative example 2～5

[0156] I. Preparation of curable composition

[0157] Each component was mixed and stirred by the compounding ratio (mass ratio) shown in Table 2, and the curable composition of Examples 9-16 and Comparative Examples 2-5 was prepared.

[0158] II. Evaluation of Adhesive Strength

[0159] II-1. Preparation of test piece

[0160] (1) Rigid substrate (copper substrate)

[0161] In the same manner as the above-mentioned Examples 1-8 and Comparative Example 1, the curable compositions of Examples 9-16 and Comparative Examples 2-5 prepared in the above-mentioned I were applied to the rigid substrate, and the test pieces were produced by the same operation.

[0162] (2) Silver electrode substrate

[0163] In the same manner as in Example 4, the curable composition of Example 9 was applied to a silver electrode substrate, and a test piece was produced by the same operation.

[0164] (3) ITO substrate

[0165] In the same manner as in Example 4, the solder paste of Example 9 was a...

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Abstract

The present invention provides a curable composition and electronic components. Especially, the present invention provides a curable composition which is able to ensure excellent bonding strength in a low temperature and a low pressure and electrically connected with components. The curable composition is characterized by comprising (A) compounds containing an olefinic unsaturated bond, (B) peroxide and (C) solder powder. Besides, the curable composition is a composition containing (A) the compounds containing the olefinic unsaturated bond, (B) the peroxide and (D) an organic binder bond and (C) the solder powder. The olefinic unsaturated bond in the organic component (deducting solvent when the solvent is contained) has an equivalence of more than 260.

Description

technical field [0001] The present invention relates to a curable composition, and particularly relates to a curable composition suitable for electronic components as a conductive adhesive capable of electrically connecting members at low temperature and low pressure in a short period of time. Background technique [0002] In the field of electronic equipment or circuit formation technology of electronic equipment, the following method is used when electronic components are mounted on a substrate: a method of melting cream solder mixed with solder powder and flux to obtain electrical conductivity and connection strength . However, in order to electrically connect members to each other using such cream solder, processing at high temperature is required, and therefore, it is necessary to reliably protect the mounted components from heat. [0003] On the other hand, low-melting-point solder is used to enable conductive connection at low temperature, and a technique of a conduc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J4/02C09J11/04C09J11/06
Inventor 福岛和信佐佐木正树仲田和贵须藤大作大渕健太郎
Owner TAIYO HLDG CO LTD