Piezoelectric composite material surface electrode and preparation method thereof
A piezoelectric composite material, surface electrode technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, circuits, etc., can solve the problem that the film adhesion is difficult to meet the actual requirements requirements, it is difficult to ensure the service life of the device, and the electroless Ag plating solution is unstable, so as to achieve the effect of satisfactory adhesion, good compactness and smooth surface
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[0023] Such as figure 1 as shown, figure 1 A schematic flow chart of the piezoelectric composite material surface electrode prepared according to the preparation method of the present invention is shown. Specifically, the preparation method of the surface electrode of the piezoelectric composite material includes: step 1, grinding the surface of the piezoelectric composite material until the roughness is Ra=0.05-0.1; step 2, grinding the surface of the piezoelectric composite material Cleaning, then drying; Step 3, at normal temperature, using DC magnetron sputtering process to prepare a thinner first layer of NiCr alloy film material on the surface of the piezoelectric composite material; Step 4, using DC magnetron sputtering The second layer of Ag thin film material is directly prepared on the first layer of thin film material by the irradiation process.
[0024] In step 2, the organic impurities on the surface of the piezoelectric composite material are removed by ultraso...
Embodiment 1
[0032] Such as figure 2 As shown, in this embodiment, a NiCr / Ag thin film is prepared on the 1-3 type PZT / epoxy piezoelectric composite material 1 (the polymer binder is an epoxy polymer) as a surface electrode. First, grind the surface roughness of the piezoelectric composite material 1 to a composite material with Ra=0.05-0.10, ultrasonically clean it in a trichlorethylene solution for 1 minute, and then use alcohol and deionized water to ultrasonically clean it twice for 10 minutes each. , and then dry the composite with a vacuum oven. The equipment used for DC magnetron sputtering is JGP-450A magnetron sputtering system. During the preparation process, the substrate is fixed and stationary. The targets used are NiCr (80 / 20.wt%) alloy target with a purity of 99.95% and an Ag target with a purity of 99.99%, and the diameter and thickness of the targets are 60 mm and 6 mm, respectively. Magnetron sputtering is carried out under the following conditions: normal temperature...
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