High thermal conductive silicone grease and preparation method thereof

A technology of thermal conductive silicone grease and high thermal conductivity, applied in the field of polymer interface materials, can solve the problems of poor relative thermal conductivity and low thermal conductivity of heat-dissipating silicone grease, achieve strong heat transfer ability, high thermal conductivity, and overcome low thermal conductivity. Effect

Inactive Publication Date: 2016-02-17
JIANGNAN GRAPHENE RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Overcome the shortcomings of low thermal conductivity and relatively poor

Method used

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  • High thermal conductive silicone grease and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0035] Example 1

[0036] A high thermal conductivity silicone grease, including the following components, in parts by mass: 28.98 parts of silicone oil, 70 parts of aluminum nitride, 0.01 parts of carbon nanotubes, 1 part of graphene foam, and 0.01 parts of graphene sheets.

[0037] Among them, the particle size of aluminum nitride is 3-5 μm, the silicone oil is methyl long-chain alkyl silicone oil, and the viscosity is 500 cps at 25°C.

[0038] Preparation

[0039] Add silicone oil and thermally conductive filler to a double planetary mixer for mixing and stirring for 20 minutes, and then grind and disperse it on a three-roll mill for 2 times after stirring, and then vacuum and stir under vacuum for 1 hour to obtain the final silicone grease. After measurement, its thermal conductivity is 0.9W / m·K.

Example Embodiment

[0040] Example 2

[0041] A high thermal conductivity silicone grease, comprising the following components, by mass: 2 parts of silicone oil, 50 parts of graphite, 13 parts of carbon fiber, 10 parts of carbon nanotubes, 5 parts of graphene foam, and 20 parts of graphene sheets.

[0042] Among them, the particle size of graphite is 3500 mesh, the silicone oil is a mixture of phenyl silicone oil, vinyl silicone oil and hydroxy silicone oil, and the viscosity at 25°C is 15000 cps.

[0043] Preparation

[0044] Add silicone oil and thermally conductive filler to a small kneader for mixing and stirring for 20 minutes. After stirring evenly, grind and disperse 3 times on a three-roll mill, then vacuum and stir for 2 hours under vacuum to obtain the final silicone grease. After measurement, its thermal conductivity is 1.1W / m·K.

Example Embodiment

[0045] Example 3

[0046] A high thermal conductivity silicone grease, including the following components, by mass: 25 parts of silicone oil, 50 parts of graphite, 20 parts of alumina, 0.5 parts of carbon fiber, 1 part of graphene foam, 2.5 parts of graphene sheets, 1 part of carbon nanotubes Parts; among them, graphite is flake graphite, the particle size of graphite is 3500 mesh, and the particle size of alumina is 0.02-20μm. Among them, the silicone oil is a mixture of amino silicone oil and dimethyl silicone oil, and the viscosity is 1000cps at 25°C.

[0047] Preparation

[0048] Add silicone oil and thermally conductive filler to a double planetary mixer for mixing and stirring for 20 minutes. After evenly stirring, grind and disperse on a three-roll mill for 3 times, then vacuum and stir for 2 hours under vacuum to obtain the final silicone grease. After measurement, its thermal conductivity is 1.8W / m·K.

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Abstract

The invention provides high thermal conductive silicone grease. The high thermal conductive silicone grease is composed of 2%-50% of silicone oil and 50%-98% of additives. The prepared thermal conductive silicone grease is high in thermal conductive coefficient, strong in thermal transfer capability, capable of improving the reliability of electronic products and prolonging the service life of the electronic products and simple in preparation technology. The defects that in the prior art, the thermal conductive coefficient of thermal dissipation silicone grease is small, and the relative thermal conductive capacity is poorer are overcome.

Description

technical field [0001] The invention relates to the field of polymer interface materials, in particular to high thermal conductivity silicone grease and its preparation method Background technique [0002] With the continuous development of modern technology, electronic products present a trend of densification and miniaturization. Due to the increase in the power of electronic appliances, a large amount of heat will be generated during use, which puts forward higher requirements for heat dissipation. Effectively remove the heat generated by electronic equipment, which directly affects the reliability and service life of the product. [0003] For the heat dissipation of high-power electronic components, a common method is to install a heat sink on the heat source. However, even if two smooth surfaces are in contact with each other between the heat source and the radiator, there is inevitably a certain gap. The existence of the gap allows heat dissipation to pass through th...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/07C08L83/06C08K13/06C08K9/00C08K3/28C08K7/24C08K3/04C08K7/00C08K7/06C08K3/22C08K3/38
Inventor 李修兵
Owner JIANGNAN GRAPHENE RES INST
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