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Encapsulating compound for thin-film capacitor

A film capacitor and encapsulant technology, applied in the field of capacitors, can solve problems such as easily damaged metallized films, capacitor temperature rise, and affect capacitor life, and achieve good insulation performance, good thermal conductivity, and low raw material costs.

Inactive Publication Date: 2016-02-24
HUAIAN SHENGYU ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The thermal conductivity of the encapsulant in the prior art is relatively poor, and the heat generated by the metallized film in the capacitor cannot be effectively dissipated outside the capacitor shell when the current passes through, resulting in an increase in the internal temperature of the capacitor, which is easy to damage the metallized film in the capacitor , affecting capacitor life

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] An encapsulant for film capacitors, characterized in that it comprises the following raw materials by weight: 60 parts of phenolic resin, 15 parts of silicone rubber, 5 parts of polyphenylene sulfide resin, 3 parts of trimellitic anhydride, 5 parts of terephthalaldehyde share.

[0011] The preparation and use methods of the present invention are as follows: firstly weighing various raw materials by weight, putting them into the material box of the injection molding machine, stirring and mixing various raw materials in the injection molding machine, and after fully mixing, the injection molding machine will The colloid is injected into the capacitor to seal the metallized film in the capacitor in the capacitor shell. After the encapsulating glue is completely solidified, the capacitor is connected to the high-frequency power supply, and the temperature of the side capacitor is turned off. When the capacitor shell temperature reaches 93 °C, the power is turned off and Aft...

Embodiment 2

[0013] An encapsulant for film capacitors, characterized in that it comprises the following raw materials by weight: 70 parts of phenolic resin, 20 parts of silicone rubber, 10 parts of polyphenylene sulfide resin, 5 parts of trimellitic anhydride, 8 parts of terephthalaldehyde share.

[0014] The preparation and use methods of the present invention are as follows: firstly weighing various raw materials by weight, putting them into the material box of the injection molding machine, stirring and mixing various raw materials in the injection molding machine, and after fully mixing, the injection molding machine will The colloid is injected into the capacitor to seal the metallized film in the capacitor in the capacitor shell. After the encapsulant is completely solidified, the capacitor is connected to the high-frequency power supply, and the temperature of the side capacitor is turned off. When the capacitor shell temperature reaches 98 °C, the power is turned off and After cut...

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PUM

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Abstract

The invention discloses an encapsulating compound for a thin-film capacitor and relates to the technical field of capacitors. The encapsulating compound is prepared from, by weight, 60-70 parts of phenolic resin, 15-20 parts of silicone rubber, 5-10 parts of polyphenylene sulfide resin, 3-5 parts of trimellitic anhydride and 5-8 parts of terephthalaldehyde. The raw materials are low in cost, the encapsulating compound is convenient to use, has very good insulation performance, is waterproof and moisture-proof, has very good heat conduction performance and can effectively dissipate heat produced by the capacitor during working outside a capacitor housing, and a toughening agent is added so that the phenomenon that solidified colloid breaks in the capacitor housing to cause capacitor damage can be prevented.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to an encapsulant for film capacitors. Background technique [0002] There are many types of capacitors depending on the medium, such as: electrolytic capacitors, paper capacitors, film capacitors, ceramic capacitors, mica capacitors, air capacitors, etc., but the most frequently used in audio equipment are electrolytic capacitors and films. Capacitors and electrolytic capacitors are mostly used in places where large capacitance is required, such as filter capacitors in the main power supply. In addition to filtering, they are also used to store electrical energy, while film capacitors are widely used in the cross-connection of analog signals. , bypass of power supply noise, etc. [0003] The thermal conductivity of the encapsulant in the prior art is relatively poor, and the heat generated by the metallized film in the capacitor when passing current cannot be effectively dissip...

Claims

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Application Information

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IPC IPC(8): C09J161/06C09J183/04C09J181/02C09J11/06
Inventor 宗启军
Owner HUAIAN SHENGYU ELECTRONICS