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A hot press device for high temperature adhesive curing

A technology of high-temperature adhesive and hot-pressing device, which is applied in the field of strain testing, can solve the problems of narrow application area and cumbersome high-temperature adhesive curing system, and achieve the effects of easy operation, uniform force, and simple design

Active Publication Date: 2017-05-17
TIANJIN AEROSPACE RELIA TECH +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-temperature adhesive curing system for thin-walled parts is more cumbersome and has a narrower application area

Method used

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  • A hot press device for high temperature adhesive curing
  • A hot press device for high temperature adhesive curing
  • A hot press device for high temperature adhesive curing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Embodiment 1 of the present invention is as Figure 5 Shown, the attractive force of magnet 5 is directly adsorbed on the surface of magnetic workpiece 15 through 13 of the present invention, and the rotating end cover 1 adjusts the screw thread of force rod 3 and base 4, so that the attractive force of magnet 5 meets the test requirements. Because the frictional force of the bearing 11 is small, the force of rotating the end cover 1 is small, and the magnet 5 will not rotate with the rotation of the end cover 1 and the force bar 3 .

[0059] The magnet 5 applies force evenly to the high-temperature glue 14 through the high-temperature rubber pad 7, changes the input of the peripheral power supply connected to the electrode 9, and adjusts the temperature of the electric heater 8 to meet the curing conditions of the high-temperature glue 14.

Embodiment 2

[0061] Embodiment 2 of the present invention is as Figure 6 Shown, two 13 devices of the present invention are symmetrical to both sides of the thin-walled part 16, and are compressed by the attractive force of the magnet 5. Rotate the end cap 1 to adjust the threads of the force rod 3 and the base 4, so that the attractive force of the magnet 5 meets the test requirements. Because the frictional force of the bearing 11 is small, the force of rotating the end cover 1 is small, and the magnet 5 will not rotate with the rotation of the end cover 1 and the force bar 3 .

[0062] The magnet 5 applies force evenly to the high-temperature glue 14 through the high-temperature rubber pad 7, changes the input of the peripheral power supply connected to the electrode 9, and adjusts the temperature of the electric heater 8 to meet the curing conditions of the high-temperature glue 14.

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Abstract

The invention relates to a hot pressing device for high temperature adhesive curing. Including: end cover (1), bolt (2), force bar (3), base (4), magnet (5), high temperature rubber pad (7), electric heater (8), electrode (9), lead hole (10), bearing (11), mandrel (12); the base (4) is a cylindrical structure with an inverted "U" shape in cross section, and the upper bottom surface is provided with a through hole, and the inner wall of the through hole is provided with a thread; the base The seat (4) provides support, and the magnet (5), high-temperature rubber pad (7), and electric heater (8) are arranged inside it; the magnet (5) provides attractive force, and the upper end of the magnet (5) has an internal thread, and the direct core The mandrel thread (12c) of axle (12) connects. The advantage of the invention is that both the temperature and the applied force can be adjusted to meet the condition of multiple curing of the high-temperature glue. The device is simple in design, precise in control and easy to operate.

Description

technical field [0001] The invention relates to the technical field of strain testing, in particular to a hot pressing device for curing high-temperature adhesives. Background technique [0002] During the strain test process, the placement of the strain gauge requires the help of various strain adhesives to stick the strain gauge on the elastic body, so that the strain generated by the elastic body under the action of external load is transmitted to the sensitive grid of the strain gauge, making it produce The resistance changes, and the sensor outputs an electrical signal corresponding to the external force or the displacement of the free end. Therefore, the true degree of adhesive curing and strain transmission is not only related to the performance of the strain gauge itself, but also directly affects the performance of the sensor. [0003] High-temperature strain gauges are mainly used for stress measurement of structures and components in high-temperature environments...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B30B9/00G01B21/32
Inventor 严鲁涛杨志鹏尹涛高飞侯京锋韩澈
Owner TIANJIN AEROSPACE RELIA TECH
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