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Gold plating method for nanosilicon dioxide-epoxy resin composite material

A technology of nano-silica and epoxy resin, applied in liquid chemical plating, superimposed layer plating, metal material coating process, etc., can solve the problems of difficult surface modification and poor bonding force of plating

Active Publication Date: 2016-03-09
SHENZHEN RUN SUN CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the existing problems such as difficulty in surface modification of nano-silica-epoxy resin composite materials and poor adhesion of coatings, the present invention proposes a gold-plating method for nano-silica-epoxy resin composite materials. Gold-plated nano-silica-epoxy composite material has good plating stability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A kind of gold plating method of nano silicon dioxide-epoxy resin composite material, comprises the following steps:

[0037] 1) Alkaline degreasing and expansion activation

[0038] Add the anti-white water into the alkaline degreasing solution to obtain the degreasing and swelling solution, put the test piece of the nano-silica-epoxy resin composite material into the degreasing and swelling solution, carry out the degreasing at a temperature of 80°C for 30 minutes, and then Take out the water and wash it clean; wherein, the alkaline degreasing solution is prepared from 10g / L sodium hydroxide, 30g / L sodium carbonate, 20g / L sodium phosphate, 3g / L sodium dodecylsulfonate and deionized water, The mass ratio of alkaline degreasing solution to anti-white water is 1:2;

[0039] 2) Alkaline coarsening

[0040] Put the test piece that has undergone degreasing and swelling treatment into the alkaline roughening solution, and roughen it at 65°C for 10 minutes, then take it out...

Embodiment 2

[0054] A kind of gold plating method of nano silicon dioxide-epoxy resin composite material, comprises the following steps:

[0055] 1) Alkaline degreasing and expansion activation

[0056] Add the anti-white water into the alkaline degreasing solution to obtain the degreasing and swelling solution, put the test piece of the nano-silica-epoxy resin composite material into the degreasing and swelling solution, carry out the degreasing at a temperature of 80°C for 30 minutes, and then Take out the water and wash it clean; wherein, the alkaline degreasing solution is prepared by 10g / L sodium hydroxide, 20g / L sodium carbonate, 30g / L sodium phosphate, 3g / L sodium dodecylsulfonate and deionized water, The mass ratio of alkaline degreasing solution to anti-white water is 1:3;

[0057] 2) Alkaline coarsening

[0058] Put the test piece that has undergone degreasing and swelling treatment into the alkaline roughening solution, and roughen it at a temperature of 75°C for 15 minutes, t...

Embodiment 3

[0072] A kind of gold plating method of nano silicon dioxide-epoxy resin composite material, comprises the following steps:

[0073] 1) Alkaline degreasing and expansion activation

[0074] Add the anti-whitening water into the alkaline degreasing solution to obtain the degreasing and swelling solution, put the test piece of the nano-silica-epoxy resin composite material into the degreasing and swelling solution, and carry out degreasing at a temperature of 70°C for 10 minutes, and then Take out the water and wash it clean; wherein, the alkaline degreasing solution is prepared by 5g / L sodium hydroxide, 30g / L sodium carbonate, 30g / L sodium phosphate, 1g / L sodium dodecylsulfonate and deionized water, The mass ratio of alkaline degreasing solution to anti-white water is 1:1.5.

[0075] 2) Alkaline coarsening

[0076] Put the test piece that has undergone degreasing and swelling treatment into the alkaline roughening solution, and roughen it at a temperature of 55°C for 10 minut...

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PUM

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Abstract

The invention provides a gold plating method for a nanosilicon dioxide-epoxy resin composite material. The gold plating method includes the following step: (1) a swelling agent is added into an alkaline oil removing solution to obtain an oil removing swelling solution, a test piece of the nanosilicon dioxide-epoxy resin composite material is placed into the oil removing swelling solution, oil removing is carried at the temperature ranging from 70 DEG C to 80 DEG C for 10 min to 30 min, and then the test piece is taken out and washed to be clean; (2) the test piece obtained after oil removing swelling processing is placed into an alkaline coarsening solution, coarsening processing is carried out at the temperature ranging from 55 DEG C to 75 DEG C for 5 min to 15 min, and then the test piece is taken out and washed to be clean, wherein the alkaline coarsening solution is prepared from 5-15 g / L of potassium permanganate, 2-5 g / L of sodium hydroxide and deionized water; (3) neutralization is carried out; (4) acid pickling is carried out; (5) activating is carried out; (6) chemical nickel-plating is carried out; (7) electro nickelling is carried out; and (8) electrogilding is carried out. The plating layer stability of the nanosilicon dioxide-epoxy resin composite material obtained with the method is good.

Description

technical field [0001] The invention relates to the technical field of surface treatment of composite materials, in particular to a gold-plating method for nano-silica-epoxy resin composite materials. Background technique [0002] Nano-silica is an amorphous white powder. There are a large number of unsaturated residual bonds and hydroxyl groups in different bonding states in its molecular structure, and its molecular structure is a three-dimensional chain structure. This structure can bond with certain groups of the resin, thereby greatly improving the hardness and strength of the material. At the same time, nano-SiO 2 Due to the small size, the particles will be distributed in the gaps of the polymer bonds when they are combined with the resin in an appropriate way, thus greatly improving the strength, toughness and ductility of the polymer. [0003] Epoxy resin has the advantages of excellent adhesion, chemical stability, mechanical properties, low shrinkage, easy proce...

Claims

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Application Information

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IPC IPC(8): C23C28/02C23C18/32C23C18/20C23C18/22C25D5/12C25D3/48C25D3/12
CPCC23C18/1641C23C18/20C23C18/2073C23C18/22C23C18/32C23C28/023C25D3/12C25D3/48C25D5/12
Inventor 帅和平
Owner SHENZHEN RUN SUN CHEM TECH