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A kind of preparation method of epoxy pouring structural adhesive
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A structural adhesive and epoxy technology, applied in the direction of epoxy resin adhesive, adhesive, adhesive type, etc., can solve the problems of high viscosity, difficult construction, inability to repair with building cracks, insufficient strength, etc., to improve the toughness of the cured product , production and preparation process and easy control, the effect of simple production and preparation process
Active Publication Date: 2018-02-23
JIANGSU SOBUTE NEW MATERIALS +1
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[0003] Chinese patent document CN 102925091 A describes a high-strength and high-toughness epoxy resin adhesive and its preparation method. The invention uses epoxy resin, diluent, coupling agent, fiber, filler, amine curing agent, etc. to prepare a High-strength and high-toughness epoxy adhesive, but it has defects such as high viscosity and difficult construction, so it cannot be used for perfusion repair of building cracks
Chinese patent document CN 104449508A provides a kind of flexible epoxy structural adhesive and its preparation method. It is invented by pre-reacting traditional flexible polyetheramine with diepoxy epoxy resin to prepare modified polyetheramine, and then It is used in the formulation of epoxy resin structural adhesive. The epoxy structural adhesive obtained by this invention has good low-temperature flexibility, but it also has the problem of high viscosity and obvious insufficient strength. When it is applied to building crack repair When its own tensile strength and the bonding force with concrete are difficult to bear the force of the building structure
Chinese patent document CN104497941A discloses a building structural adhesive with good flexibility and good damping performance. The invention uses epoxy resin, polysulfide rubber, reactive diluent, curing agent, accelerator, etc. to prepare a low-temperature flexible and adhesive adhesive. It is a material with high bond strength, but it also has the problem of high initial viscosity of the glue, which limits its application in building crack repairing and pouring
Although the toughness of the material in the modified system is enhanced to a certain extent, due to the high content of side epoxy hydrocarbon groups and the high density of side chains, when the material is at low temperature (below 0°C), the flexibility of the silicone segment is affected by high The degree of cross-linking cannot be fully reflected, resulting in poor toughness of the material at low temperature
In addition, some researchers have used polydimethylsiloxane-based amino silicone polymer (ASO) to modify epoxy materials, which have improved heat resistance, but lower mechanical properties
Therefore, the current common silicone polymer modified epoxy materials have certain limitations.
Method used
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Embodiment 1
[0086] Epoxy pouring structural adhesive, composed of A component and B component, of which
[0087] A component:
[0088] 100 parts epoxy resin
[0089] Modified epoxy diluent 30 parts
[0090] 0.5 parts of defoamer
[0091] B component:
[0092] Curing agent 28 parts
[0093] Accelerator 3 parts
[0094] 1 part coupling agent
[0095] The epoxy resin is bisphenol A epoxy resin E55, the modified epoxy diluent is HY669-AFSO1, the curing agent is amino-terminated ether D150, and the accelerator is 2,4,6-tris(dimethylaminomethyl)phenol, The coupling agent is aminopropyltriethoxysilane.
Embodiment 2
[0097] Epoxy pouring structural adhesive, composed of A component and B component, of which
[0098] A component:
[0099] 100 parts epoxy resin
[0100] Modified epoxy diluent 40 parts
[0101] 1 part defoamer
[0102] B component:
[0103] Curing agent 42 parts
[0104] Accelerator 5 parts
[0105] 2 parts of coupling agent
[0106] The epoxy resin is bisphenol A epoxy resin E51, the modified epoxy diluent is HY669-622-AFSO2, the curing agent is amino-terminated ether D230, the accelerator is benzyldimethylamine, and the coupling agent is 3-aminoethyl Aminopropyltriethoxysilane.
Embodiment 3
[0108] Epoxy pouring structural adhesive, composed of A component and B component, of which
[0109] A component:
[0110] 100 parts epoxy resin
[0111] Modified epoxy diluent 50 parts
[0112] 1.5 parts of defoamer
[0113] B component:
[0114] Curing agent 30 parts
[0115] Accelerator 8 parts
[0116] 2 parts of coupling agent
[0117] The epoxy resin is bisphenol F epoxy resin F44, the modified epoxy diluent is HY669-622-678-AFSO3, the curing agent is amino-terminated ether T250, the accelerator is o-hydroxybenzyldimethylamine, and the coupling agent is γ-Glycidoxypropyltrimethoxysilane.
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Abstract
The present invention provides a preparation method of an epoxy infusion structural adhesive. The introduction of a silicone polymer modified epoxy material can reduce the initial viscosity of glue solution and improve the mechanical properties after curing. The epoxy infusion structural adhesive comprises a component A containing epoxy resin and a component B comprising a curing agent. The component A comprises 100 parts by weight of epoxy resin and 30-50 parts by weight of a modified epoxy diluent. The modified epoxy diluent is obtained by pre-reaction of a specific difunctional epoxy diluent and a specific amino fluorine-containing organosilicon polymer in the weight ratio of 100:(60-120), and the pre-reaction is the reaction of epoxy group and amino group. The invention uses the pre-reaction of amino fluorine-containing silicone polymer with the bifunctional epoxy diluent to obtain the modified epoxy diluent, which is used for modification of epoxy resin infusion structural adhesive, so as to reduce initial viscosity of the glue solution and ensure the curing mechanics performance.
Description
technical field [0001] The invention belongs to the field of building materials, and in particular relates to a preparation method of epoxy perfusion structural glue. Background technique [0002] Due to its high strength and good deformation resistance, epoxy pouring structural adhesive has become one of the most widely used materials for crack repair in the field of building repair and reinforcement. At present, for general buildings, not only the building structure is required to have high strength, but at the same time, in order to improve the earthquake resistance level of the building, crack repair materials also need high toughness to resist instantaneous impact loads and certain cyclic loads. Therefore, it is necessary to overcome the brittleness of traditional epoxy perfusion structural adhesives. [0003] Chinese patent document CN 102925091 A describes a high-strength and high-toughness epoxy resin adhesive and its preparation method. The invention uses epoxy res...
Claims
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Application Information
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