Method and device for positioning side-by-side diodes
A positioning method and positioning device technology, applied in the direction of measuring devices, instruments, and material analysis through optical means, can solve the problems of large position changes, dependence, and difference in diode height, so as to avoid omissions and improve accuracy.
Active Publication Date: 2017-12-19
GUANGZHOU SHIKUN ELECTRONICS TECH CO LTD
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Problems solved by technology
[0004] However, the above-mentioned positioning method is extremely dependent on the diode position information marked in the manual plate-making process, and the side-by-side diode groups (take the diodes arranged vertically side by side as an example), especially the side-by-side diode groups with high pins, the position in the vertical direction The change is large, the actual position of the diode on the circuit board to be tested may differ from the position of the diode marked in the manual plate making process by two diode heights
Therefore, directly using the diode position information marked in the manual plate-making process to search is extremely prone to misalignment. For example, the position of the located diode is not the position of the diode to be located, but the position of its adjacent diode, resulting in the diode Inaccurate positioning
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[0052] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0053] see figure 1 , a schematic flow chart of an embodiment of a positioning method for side-by-side diodes provided by the present invention, including:
[0054] S1. Extract the detection area image of the diode group from the circuit board image; wherein, the diode group includes N diodes arranged side by side, N≥1;
[0055] S2. Match the detection area image with the template image of each diode in the diode group, and acquire first positioning information of...
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The invention discloses a positioning method for side-by-side diodes, which includes: extracting a detection area image of a diode group from a circuit board image; wherein, the diode group includes N diodes arranged side by side, N≥1; The area image is matched with the template image of each diode in the diode group, and the first positioning information of each diode arranged side by side in the detection area image is obtained; the pins of each side-by-side diode in the detection area image are identified, Acquiring second positioning information of each diode arranged side by side in the detection area image; and locating each diode in the detection area image according to the first positioning information and the second positioning information. Correspondingly, the invention also discloses a positioning device for side-by-side diodes. By adopting the embodiment of the present invention, the positioning accuracy of each side-by-side diode can be improved.
Description
technical field [0001] The invention relates to the field of automatic optical inspection, in particular to a positioning method and device for parallel diodes. Background technique [0002] Automated Optical Inspection (AOI, Automated Optical Inspection) is a necessary link in the industrial production process. It uses optical methods to obtain the surface state of finished products, and uses image processing to detect foreign objects or surface defects. The error, leakage and reverse detection of manually inserted diodes is a common application in the field of circuit board defect detection. Through image processing technology, it is judged whether there are faults, leaks, or anti-defects in the diode components, and finally the suspected defective components are displayed or marked for easy inspection and maintenance. [0003] There are many diodes arranged side by side on the circuit board to form a side-by-side diode group. Before detecting defects of each diode elemen...
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IPC IPC(8): G06K9/62G01N21/956
CPCG01N21/956G06V10/759G06V10/751
Inventor 林建民
Owner GUANGZHOU SHIKUN ELECTRONICS TECH CO LTD