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Manufacturing method of 6oz&12oz thick copper circuit board with heat sink mounted

A technology of thick copper circuit board and manufacturing method, which is applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., to achieve the effects of accurate positioning, good bonding effect and uniform board thickness

Active Publication Date: 2018-04-17
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, in order to solve the above problems, the present invention provides a method for manufacturing a 6OZ&12OZ thick copper circuit board with a heat sink, which has good inner layer etching effect, good pressing effect, and is not prone to problems such as air bubbles and poor lamination.

Method used

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  • Manufacturing method of 6oz&12oz thick copper circuit board with heat sink mounted
  • Manufacturing method of 6oz&12oz thick copper circuit board with heat sink mounted
  • Manufacturing method of 6oz&12oz thick copper circuit board with heat sink mounted

Examples

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Effect test

Embodiment 1

[0054] A method for manufacturing a 6OZ&12OZ thick copper circuit board with a heat sink, including inner layer etching, pressing, drilling and inlaying processes,

[0055] Moreover, in the inner layer etching process, the vacuum inner layer etching line is selected for etching, the number of times of etching is twice, and the plate is turned over once after each etching, and the concentration of copper ions in the acidic copper chloride etching solution is controlled to be 115g / l during etching. , the temperature is 52°C, the number of etching is twice, and the plate is flipped once after each etching;

[0056] Further, when performing the first etching, make the 6OZ side of the 6OZ & 12OZ thick copper plate face down and the 12OZ side face up, turn off the lower pump of the vacuum etching line, only turn on the upper pump, control the pressure to 38PSI, and the speed to 1260mm / min ; When performing the second etching, make the 6OZ side of the 6OZ&12OZ thick copper plate face...

Embodiment 2

[0087] A method for manufacturing a 6OZ&12OZ thick copper circuit board with a heat sink, including inner layer etching, pressing, drilling and inlaying processes,

[0088] Moreover, in the inner layer etching process, the vacuum inner layer etching line is selected for etching, the number of times of etching is twice, and the plate is turned over once after each etching, and the concentration of copper ions in the acidic copper chloride etching solution is controlled to be 140g / l during etching. , the temperature is 49°C;

[0089] Further, when performing the first etching, make the 6OZ side of the 6OZ&12OZ thick copper plate face down and the 12OZ side face up, turn off the lower pump of the vacuum etching line, only turn on the upper pump, control the pressure to 40PSI, and the speed to 1230mm / min ; When performing the second etching, make the 6OZ side of the 6OZ&12OZ thick copper plate face up and the 12OZ side face down, open the upper pump and the lower pump, control the...

Embodiment 3

[0120] A method for manufacturing a 6OZ&12OZ thick copper circuit board with a heat sink, including inner layer etching, pressing, drilling and inlaying processes,

[0121] Moreover, in the inner layer etching process, the vacuum inner layer etching line is selected for etching, the number of times of etching is twice, and the plate is turned over once after each etching, and the concentration of copper ions in the acidic copper chloride etching solution is controlled to be 165g / l during etching. , the temperature is 46°C;

[0122] Further, when performing the first etching, make the 6OZ side of the 6OZ&12OZ thick copper plate face down and the 12OZ side face up, turn off the lower pump of the vacuum etching line, only turn on the upper pump, control the pressure to 42PSI, and the speed to 1200mm / min ; When performing the second etching, make the 6OZ side of the 6OZ&12OZ thick copper plate face up and the 12OZ side face down, open the upper pump and the lower pump, control the...

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Abstract

The invention provides a method for making a 6OZ&12OZ thick copper circuit board attached with cooling fins. The method comprises the processes of inner layer etching, plate pressing, drilling and inlaying. In the inner layer etching process, a vacuum inner layer etching line is selected and used to perform etching twice, and the board is turned over once after each etching; in the plate pressing process, a prepreg containing 75-80% of resin and a 6OZ&12OZ thick copper plate are selected and used as plate pressing materials, and proper plate pressing parameters are selected to perform press fit on the thick copper plate and the prepreg; in the drilling process, the hole diameter is 0.60-6.35mm, the drill speed is 18-50krpm, the feeding speed is 27-75ipm, and the tool withdrawing speed is 600-900ipm; and in the inlaying process, copper particles need to be inspected, and the copper particles and the circuit board are positioned and pressed integrally. With the adoption of the method, the inner layer etching effect is good, the plate pressing effect is good, and the problems of air bubbles, poor press fit and the like are not easily caused. Moreover, the cooling fins are attached, so that the circuit board is endowed with high-reliability characteristics of heat resistance, aging resistance, high and low temperature resistance and the like.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a 6OZ&12OZ thick copper circuit board mounted with heat sinks. Background technique [0002] In the existing circuit board manufacturing process, the inner layer copper thickness 6OZ&12OZ multilayer circuit board has the following technical difficulties. 1. The inner layer is difficult to etch: the copper thickness of the 6OZ&12OZ inner layer circuit board is inconsistent, which will produce a relatively large side erosion effect during etching, which seriously affects the effective cross-sectional shape and quality requirements of the line; , the prepreg and the oxidized inner layer board are stacked in order and pressed together to form a multi-layer board. The resin in the prepreg is a semi-hardened material, which will soften and flow after being subjected to high temperature, and fill into the gap between the lines. After a period...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0061H05K3/06H05K2203/068
Inventor 戴匡
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD