Circuit board clamping table and temperature measurement system

Abstract

The invention discloses a circuit board clamping table and a temperature measurement system and belongs to the field of temperature measurement of circuit boards of numerical control finished products. The circuit board clamping table mainly comprises a fixed base, a movable base, a horizontal guide way, a vertical guide way, a sliding block and a rotary clamping head. The size and the angle of the rotary clamping head can be adjusted according to the size and mounting angle of the measured numerical control finished product circuit boards. The temperature measurement system comprises the circuit board clamping table, a temperature sensor, an infrared imaging module, a signal acquisition module and an upper computer. By means of the circuit board clamping table and the temperature measurement system, the work temperature of the numerical control finished product circuit boards which are different in sizes and placed at different angles can be measured, the influence of gravity on hot air flow paths on the surfaces of the circuit boards can be reduced, and the test conditions are closer to the actual engineering conditions.

Description

technical field [0001] The invention belongs to the field of temperature measurement of numerically controlled finished circuit boards, and relates to a circuit board clamping platform and a system for measuring the temperature of numerically controlled finished circuit boards. Background technique [0002] With the application of high-power semiconductor components in numerical control systems, the heat flux density of finished numerical control circuit boards continues to increase, and the accumulation of heat on the board and the increase in temperature have become one of the important factors affecting product reliability. [0003] Obtaining the operating temperature of the CNC finished circuit board in the design stage can effectively evaluate its reliability. In addition, with the gradual development and application of thermal simulation technology, accurately obtaining the working temperature of the CNC finished circuit board in the early stage of product design can p...

AI Technical Summary

Problems solved by technology

This single method of measurement has the following disadvantages: (1) It is difficult to obtain complete and accurate temperature data, which brings unreliable factors to later reliability prediction and thermal simulation model calibration; (2) Different CNC finished circuit boards There are often many ways to place the equipment at various angles. Changes in temperature will lead to changes in air density. Due to the influence of gravity, the natural convection heat dissipation method for the CNC finished circuit board is adopted differently during the test and the actual installation situation. The placement method will cause changes in the airflow direction and the heat transfer path of the CNC finished circuit board, increasing the error between the measured data and the actual working conditions

In a word, when testing the temperature of the CNC finished circuit board in the prior art, the placement method of the CNC finished circuit board in the test is single, the test method is not flexible, and the test results are not accurate and complete enough.

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