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Low-dielectric-property composite material

A composite material and low dielectric technology, applied in the field of materials, can solve the problems of reducing interface performance and mechanical properties, and achieve the effect of reducing dielectric constant and dielectric loss factor

Active Publication Date: 2016-03-23
NANJING HUAGE ELECTRONICS & AUTOMOBILE PLASTIC IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are no groups that can react with these active functional groups on the molecular chains of thermosetting resins such as unsaturated polyester resins, vinyl ester resins, and one-component polyurethane resins that are cured by free radical polymerization. Even if these polymers are added, they cannot Solve the above-mentioned problems of reducing interface performance and mechanical properties

Method used

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  • Low-dielectric-property composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3、 comparative example 1-3

[0034] According to the ratio shown in Table 1, mix unsaturated polyester resin (HNH-2203), polystyrene, styrene-maleic anhydride copolymer (SartomerSMA4000), GMA, bridging agent, initiator, release agent, filler , made into a resin paste, on the pultrusion production equipment, use glass fiber to reinforce, and use the pultrusion process to prepare composite material plates, and test its dielectric constant, dielectric loss factor, and mechanical properties according to the following methods.

[0035] (1) Test of dielectric constant and dielectric loss factor

[0036] For the pure resin cast plate after curing, use a HP4291B dielectric constant measuring device (produced by Hewllet. Packerd Company) to measure the dielectric constant and dielectric loss factor at a frequency of 1 GHz.

[0037] (2) Determination of mechanical properties

[0038] The mechanical properties are measured by a universal material testing machine in accordance with "GB / T1447-2005 Test Method for Ten...

Embodiment 2

[0042] The comparison between Example 2 and Example 3, and the comparison between Comparative Example 2 and Comparative Example 3 shows that the dielectric constant of the composite material is lower when aluminum hydroxide is used as filler than calcium carbonate.

[0043] The comparison of Examples 1, 2, 3 and Comparative Example 1 shows that after adding the low-dielectric polymer of the present invention, the dielectric constant and dielectric loss of the composite material are significantly reduced; the strength loss is not large.

[0044] The comparison between Example 2 and Comparative Example 2 shows that after adding the low-dielectric polymer and bridging agent of the present invention, not only the dielectric constant is reduced more, but also the strength loss is smaller than that of directly adding polystyrene.

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Abstract

The invention relates to a low-dielectric-property composite material. The composite material is produced through a pultrusion or molding process and can be used in electrical insulation, communication and other fields requiring low dielectric properties. A low-dielectric-property polymer containing styrene structure units is creatively added into unsaturated polyester resin, vinyl ester resin, single-component polyurethane resin and other kinds of thermosetting resin cured through free radical polymerization, and the dielectric constant and the dielectric loss factor of a system are effectively reduced. Meanwhile, a bridging agent capable of chemically reacting with a styrene-maleic anhydride copolymer and the resin at the same time is creatively introduced to connect the styrene-maleic anhydride copolymer and the resin into a whole, and the interfacial property and the mechanical property of the composite material are kept. In addition, aluminum hydroxide is added into the composite material to serve as filling, and the dielectric constant and the dielectric loss factor are further reduced.

Description

technical field [0001] The invention relates to a composite material with low dielectric performance, belonging to the technical field of materials. Background technique [0002] In the application fields of electrical insulation composite materials and wave-transparent composite materials, the dielectric constant and dielectric loss factor are very critical technical indicators. For example, for electrical insulation products such as laminated composite boards, low dielectric constant and dielectric loss factor can help separate the current-carrying area from other areas; for wave-transparent products such as mobile communication radomes, low dielectric constant The electrical constant and dielectric loss factor can effectively increase its wave transmittance. [0003] Unsaturated polyester resins, vinyl ester resins, one-component polyurethane resins and other thermosetting resins that rely on free radical polymerization to cure are widely used due to their advantages of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/06C08L35/06C08K7/14C08K3/26C08K3/22
CPCC08L67/06C08L35/06C08K7/14C08K2003/265C08K2003/2227
Inventor 叶枫韬徐国忠黄定芳李峰陈浩张亚文柴瑞丹
Owner NANJING HUAGE ELECTRONICS & AUTOMOBILE PLASTIC IND