Silicon tetrachloride reduction method of dechlorination hydrogenation technology and preparation method of copper-silicon alloy catalyst containing Cu-Si metallic bond
A technology of silicon tetrachloride and metal bonds, applied in the direction of metal/metal oxide/metal hydroxide catalysts, physical/chemical process catalysts, silicon halide compounds, etc., can solve the problem of loss of catalytic activity of silicon-copper alloy catalysts and other problems , to avoid microcohesion and increase catalytic life
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Embodiment 1
[0049] This embodiment provides a method for preparing a copper-silicon alloy catalyst containing Cu-Si metal bonds for the reduction of silicon tetrachloride in the dechlorination and hydrogenation process, comprising the following steps:
[0050] (1) Cuprous chloride and silicon powder are sent to the deposition part of the fluidized bed reactor in the fluidized bed reactor, wherein, the particle diameter of cuprous chloride is 300 orders, and the particle diameter of silicon powder is chlorinated 100 times of cuprous particle size, the added amount of cuprous chloride is 0.3wt% of the added amount of silicon powder.
[0051] (2) Nitrogen is introduced into the fluidized bed reactor through the delivery gas introduction pipe, and the heating temperature is 200 ° C, so that the mixed powder is in a fluidized state; wherein, the nitrogen flow rate in the fluidized bed reactor is 0.5m / s, the porosity is 0.45. Fluidization reaction occurs by heating in the fluidized bed, the h...
Embodiment 2
[0057] This embodiment provides a method for preparing a copper-silicon alloy catalyst containing Cu-Si metal bonds for the reduction of silicon tetrachloride in the dechlorination and hydrogenation process, comprising the following steps:
[0058] (1) Cuprous chloride and silicon powder are sent to the deposition part of the fluidized bed reactor in the fluidized bed reactor, wherein, the particle diameter of cuprous chloride is 280 orders, and the particle diameter of silicon powder is chlorinated 30 times of cuprous particle diameter, the addition amount of cuprous chloride is 0.5wt% of the addition amount of silicon powder.
[0059] (2) Argon gas is passed into the fluidized bed reactor through the delivery gas introduction pipe, and the heating temperature is 250°C to form a fluidized bed; wherein, the argon gas flow rate in the fluidized bed reactor is 2m / s, and the pores The rate is 0.5. Fluidization reaction occurs by heating in the fluidized bed, the heating temperat...
Embodiment 3
[0061] This embodiment provides a method for preparing a copper-silicon alloy catalyst containing Cu-Si metal bonds for the reduction of silicon tetrachloride in the dechlorination and hydrogenation process, comprising the following steps:
[0062] (1) Cuprous chloride and silicon powder are sent to the deposition part of the fluidized bed reactor in the fluidized bed reactor, wherein, the particle diameter of cuprous chloride is 250 orders, and the particle diameter of silicon powder is chlorinated 70 times of cuprous particle diameter, the addition amount of cuprous chloride is 0.4wt% of the addition amount of silicon powder.
[0063] (2) The mixed gas of nitrogen and helium is passed into the fluidized bed reactor through the delivery gas introduction pipe, and the heating temperature is 300°C to form a fluidized bed; wherein, the nitrogen and helium in the fluidized bed reactor The flow rate of the mixed gas is 2.5m / s, and the porosity is 0.53. Fluidization reaction occur...
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