Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer Fixing Device in Evaporation Coating Process

A technology of evaporation coating and fixing device, applied in vacuum evaporation coating, metal material coating process, sputtering coating and other directions, can solve problems such as wafer damage

Active Publication Date: 2018-04-24
SUZHOU SAISEN ELECTRONICS TECH
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing evaporation coating process, the wafer is often clamped and fixed. However, because the wafer is mostly used in semiconductor production, its thickness is relatively thin, and the wafer is easily damaged in a long-term clamping state.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer Fixing Device in Evaporation Coating Process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] like figure 1 A wafer fixing device in an evaporation coating process is shown, which includes a working chamber 1, the lower end surface of the working chamber 1 is provided with a placement table 2 for placing metal materials, and an electric heat source is provided inside the placement table 2. The upper end of the working chamber 1 is provided with a fixed table 3 for fixing the wafer, and the fixed table 3 is driven by a motor 4 arranged outside the working chamber 1; To the vacuum adsorption pump 6 arranged outside the working chamber 1; the adsorption pipeline 5 includes a first pipeline 51 and a second pipeline 52, the first pipeline 51 is connected to the vacuum adsorption pump 6, and the second pipeline 52 is connected to the fixed table 3 to connect, the second pipeline 52 extends to the inside of the first pipeline 51, and the connection position between the first pipeline 1 and the second pipeline 52 is provided with a sealing ring 53; the driven gear 7 is ...

Embodiment 2

[0017] As an improvement of the present invention, in the adsorption pipeline 5, the end of the second pipeline 52 on one side of the fixed platform 3 is provided with four auxiliary adsorption pipelines 9 extending radially along the fixed platform 3, and a plurality of auxiliary adsorption pipelines 9 The pipes 9 are rotationally symmetrical with respect to the axis of the second pipe 52 , and each auxiliary adsorption pipe 9 is in contact with the wafer via the end surface of the fixing table 3 . With the above-mentioned design, it can absorb various positions of the wafer through a plurality of auxiliary adsorption pipes, so as to avoid excessive local force on the axis of the wafer and damage it.

[0018] The remaining features and advantages of this embodiment are the same as those of Embodiment 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a wafer fixing device in an evaporation coating process, which includes a working chamber, the upper end of the working chamber is provided with a fixing platform; the axial position of the fixing platform is provided with an adsorption pipeline, which is connected to A vacuum adsorption pump outside the working chamber; the adsorption pipeline includes a first pipeline and a second pipeline, the first pipeline is connected to the vacuum adsorption pump, the second pipeline is connected to the fixed platform, and the second pipeline extends to the first pipeline Inside, a sealing ring is provided at the connection position between the first pipeline and the second pipeline; a driven gear is provided on the second pipeline, and a driving gear meshed with the driven gear is provided on the upper end of the working chamber. Driven by a motor; adopting the above-mentioned technical solution, it can avoid damage to the surface of the wafer by conventional fixing methods while realizing its rotating processing.

Description

technical field [0001] The invention relates to semiconductor processing equipment, in particular to a wafer fixing device in an evaporation coating process. Background technique [0002] Evaporation coating is a process of heating a metal with a low melting point, so that the metal evaporates and adheres to the wafer to be processed to form a coating. In the existing evaporation coating process, the wafer is often clamped and fixed. However, since the wafer is mostly used in semiconductor production and its thickness is relatively thin, the wafer is easily damaged in a long-term clamping state. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a wafer fixing device in the evaporation coating process, which can prevent the wafer from being damaged during the fixing and working process. [0004] In order to solve the above technical problems, the present invention relates to a wafer fixing device in the evaporation...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/50C23C14/24
CPCC23C14/24C23C14/50H01L21/6838H01L21/68792
Inventor 史进伍志军
Owner SUZHOU SAISEN ELECTRONICS TECH