A pneumatic positioning mechanism for positioning bga chips in testing

Abstract

The invention discloses a pneumatic positioning mechanism used for positioning a BGA chip in a test. The pneumatic positioning mechanism comprises a testing seat and a cylinder. The testing seat is provided with a positioning cavity used for carrying the BGA chip. The sliding block of the cylinder is provided with a pushing plate correspondingly cooperated with the position of the positioning cylinder, and the pushing plate can move forwards and backwards along the diagonal of the positioning cavity. The pushing plate is provided with a first positioning block used for pushing the BGA chip to move along the X direction of the positioning cavity, and a second positioning block used for pushing the BGA chip to move along the Y direction of the positioning cavity. The pneumatic positioning mechanism is advantageous in that the pneumatic counterpoint of the BGA chip can be carried out, and the problems such as the gap between the peripheral inner wall of the positioning cavity and the shape of the BGA chip, the corresponding conduction of the probes on the testing seat and the solder balls on the back surface of the BGA chip can be solved, the production yield and the production efficiency of the BGA chip can be improved, and at the same time, the production costs of the BGA chip can be reduced.

Description

technical field [0001] The invention relates to a positioning mechanism, in particular to a pneumatic positioning mechanism used for positioning BGA chips during testing. Background technique [0002] The BGA chip needs to be powered on to test its electrical characteristics during the test process. The general test method is to place the BGA chip in the positioning cavity on the test seat, and make the probe on the test seat (ie POGO PIN ) and the solder balls on the back of the BGA chip are connected one by one to make them energized. However, the above method has great disadvantages. In order to be compatible with the shape tolerance of the BGA chip and easy to pick and place the chip, the positioning cavity on the test seat has a certain gap between the inner wall of the positioning cavity and the shape of the BGA chip. When the solder ball on the BGA chip When there is a large deviation from the outline size of the BGA chip, due to the existence of these gaps, the prob...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a pneumatic positioning mechanism for positioning the BGA chip in the test; through the pneumatic positioning mechanism, the method for pneumatic alignment of the BGA chip is realized, effectively eliminating the problem caused by the positioning type There is a gap between the inner wall around the cavity and the shape of the BGA chip, which leads to the problem that the probes on the test seat and the solder balls on the back of the BGA chip cannot be connected one by one, and the pneumatic positioning mechanism provided by the present invention reduces the pressure on the BGA chip. The relative dimensional accuracy requirements between the solder ball and the shape of the BGA chip improve the yield and production efficiency of the BGA chip manufacturing, while reducing the production cost of the BGA chip

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