Semiconductor sequencing chip and gene sequencer

Abstract

The invention relates to the field of gene sequencing devices, and provides a semiconductor sequencing chip and a gene sequencer. The semiconductor sequencing chip sequentially comprises a substrate, a flowing chamber and a chip cover from bottom to top. The substrate comprises a sensor array and a micropore array located above the sensor array. The sensor array is provided with a plurality of sensors, and the sensors correspond to micropores in the micropore array in a one-to-one mode. The chip cover is provided with a reagent inlet and a first reagent outlet, and the reagent inlet and the first reagent outlet are formed in the two ends of the flowing chamber respectively. The distance between the middle of the inner surface of the chip cover and the substrate is small, and the distances between the two sides of the inner surface of the chip cover and the substrate are large. The semiconductor sequencing chip further comprises a reference electrode, and the reference electrode is communicated with liquid in the flowing chamber and provides reference voltage for the sensors. According to the semiconductor sequencing chip and the gene sequencer, due to the special design of the inner surface of the chip cover, the coincidence of the flowing speeds of a reagent in all the portions of the flowing chamber is better, interference signals in obtained sequencing data are reduced, and sequencing accuracy is improved.

Description

technical field [0001] The invention relates to the field of gene sequencing equipment, more specifically, to a semiconductor sequencing chip and a gene sequencer. Background technique [0002] High-Throughput Sequencing (High-Throughput Sequencing), also known as Next Generation Sequencing (NGS), is relative to traditional Sanger Sequencing (Sanger Sequencing). With the development of next-generation sequencing technology, a semiconductor sequencing method (Semi-conductorSequencing) has emerged in recent years, which immobilizes the DNA strand in the microwell of the semiconductor chip, and hybridizes the sequencing primer to the DNA strand immobilized in the microwell, Then A, C, G, and T are incorporated in sequence. With the incorporation of bases, under the action of polymerase, the sequencing primers are extended and hydrogen ions are released, and the released hydrogen ions pass through the micropores of the chip. At the bottom, it can be detected. Through the detect...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a semiconductor sequencing chip and a gene sequencer, aimin

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