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Operation method of substrate cutting device and substrate cutting device

A cutting-off device and operating method technology, applied in positioning devices, maintenance and safety accessories, clamping, etc., can solve problems such as increased production costs, achieve the effects of extended life, low on-off frequency, and reduced replacement costs

Active Publication Date: 2018-06-29
HITACHI ASTEMO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the work of cleaning the substrate after cutting is increased, and the production cost is increased.

Method used

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  • Operation method of substrate cutting device and substrate cutting device
  • Operation method of substrate cutting device and substrate cutting device
  • Operation method of substrate cutting device and substrate cutting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0045] Such as figure 1 As shown, the substrate 10 is placed on the tray 33 with the mounted semiconductor device 11 facing downward, and is placed on the cutting jig 40 .

[0046] The substrate 10 is provided with a transverse opening 12 at the center, and on one side of the left and right sides, a first U-shaped notch 13, a first elongated hole 14, a transverse opening 12, a second elongated hole 15, a third elongated hole 16 and a first elongated hole 16. Two U-shaped notches 17 are formed in a row. The same goes for the other side on the left and right. In addition, four positioning holes 18 are provided so as to cross the opening 12 .

[0047] On the left side, between the first U-shaped notch 13 and the first elongated hole 14, there is a first part to be cut off 21, and between the first elongated hole 14 and the transverse opening 12, there is a second part to be cut off 22. There is the 3rd cutting planned portion 23 between the piercing opening 12 and the second e...

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PUM

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Abstract

The invention relates to an operating method of a substrate cutting-off device and the substrate cutting-off device. A suspended matter efficient removing technology through which the substrate does not need to be cleaned after being cut off in the substrate cutting-off device. The operating method of the substrate cutting-off device comprises a substrate cutting-off step of cutting of the substrate by means of a tool, and discharging cuttings generated during the cutting-off process by a cutting-off fixture through an exhausting mechanism; a suspended matter discharging step of taking the cut-off substrate down from the cutting-off fixture and placing a next substrate on the cutting-off fixture, and discharging cuttings flying apart or floating around the cutting-off fixture by a perforated plate through the exhausting mechanism. Because suspended matter is discharged by force in the suspended matter discharging step, people do not need to worry about that suspended matter adheres to the substrate.

Description

technical field [0001] The present invention relates to a cutting device for substrates, especially mounted substrates, and an operating method thereof. Background technique [0002] After the device is mounted on the substrate, the edge of the mounting substrate is cut off, and the mounting substrate is cut and divided. Cutting is done using a rotating tool called a milling cutter. Chips are generated along with cutting. If the shavings are left unattended, defects such as adhesion to the substrate may occur. [0003] Therefore, chip discharge technology has been proposed in the past (for example, refer to Patent Document 1 ( figure 1 , Figure 4 )). [0004] As in Patent Document 1 Figure 4 As shown, the dust collecting nozzle (9) is attached to the tray main body (21) on which the substrate is placed (the numerals in parentheses indicate the reference numerals described in Patent Document 1. Hereinafter, the same applies). [0005] As in Patent Document 1 figure ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23Q11/00B23Q3/06B23C3/00
CPCB23C3/00B23C2220/12B23Q3/062B23Q11/006
Inventor 河东田贤尊宫城淳
Owner HITACHI ASTEMO LTD
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