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Over drive calibration method for wafer acceptance test platforms

A technology for wafer acceptance testing and calibration methods, applied to measuring devices, measuring electrical variables, instruments, etc., can solve problems such as lack of accuracy, unreliable results, and long calibration time, so as to improve utilization and increase reliability , the effect of reducing the use of time

Active Publication Date: 2016-04-27
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of calibration process needs to use the wafer acceptance test machine to test the wafer many times, the calibration time is long, and the utilization rate of the machine is wasted; at the same time, the specification range of the machine is set by empirical values, so the result is not reliable enough Compared with the current FAB manufacturing process, it lacks precision

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  • Over drive calibration method for wafer acceptance test platforms

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Embodiment Construction

[0023] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the following combination Attached picture The specific embodiment of the present invention will be described in detail.

[0024] Please refer to figure 1 , in order to achieve the above object, the present invention provides a method for pressurizing and calibrating a wafer acceptance testing machine, comprising the following steps:

[0025] Step 1: Provide a reference probe card for wafer testing. Generally, the probe diameter of the reference probe card is 35nm.

[0026] Step 2: Fix the reference probe card on several wafer acceptance test machines, and place the same wafer on all the above wafer acceptance test machines to test with the reference probe card. The pad and bump materials in different wafers have different compositions, so the same wafer must be used to ensure the subsequent needle marks picture For example, the traces...

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Abstract

The invention provides an over drive calibration method for wafer acceptance test platforms. The same probe cards are fixed on the different wafer acceptance test platforms respectively to test wafers, needle mark images formed when the probe cards on the wafer acceptance test platforms test the wafers are extracted, the intermediate value of the over drive value of each needle mark image is calculated, the intermediate value of the over drive value of each wafer acceptance test platform is extracted to implement data fitting, a specification range of the over drive values is obtained, and the over drive value of each wafer acceptance test platform is adjusted to the specification range of the over drive values. According to the over drive calibration method provided by the invention, the needle mark image can be formed by only once test for the wafer by the wafer acceptance test platform, the needle mark images are extracted and calculated to obtain the intermediate value of the over drive value, the utilization time of the platform is reduced, the utilization rate is improved, the data is fit to obtained the specification range of the over drive values, and the setting credibility of the specification range of the over drive values is enhanced.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for pressurizing and calibrating a wafer acceptance testing machine. Background technique [0002] WAT (Wafer acceptance test, wafer acceptance test) is an electrical measurement of the chip after the process is completed, and is used to check whether each process process meets the standard. The test items include device characteristic test, capacitance test, contact resistance test, and breakdown. test etc. Generally, the probe card is fixed on the wafer acceptance test machine, the wafer or chip to be tested is placed on the wafer acceptance test machine, and the probe card is used to clamp the pad or bump on the wafer or chip, that is Overdrive to test the wafer. [0003] When the probe card tests the wafer, the probe card applies pressure to the pads or bumps on the wafer, leaving needle marks on the pads or bumps, and each wafer acceptance tester The ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R35/00
CPCG01R35/005
Inventor 龚丹莉邵雄
Owner SHANGHAI HUALI MICROELECTRONICS CORP