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A production method of chip resistors avoiding failure of resistance value

A technology of chip resistance and production method, which is applied to the direction of adding resistors at the lead-out end, resistors, and manufacturing resistor chips, etc., which can solve the problems of product surface electrode shedding, affecting product yield, resistance failure, etc., and achieve product quality improvement. , cost saving, and the effect of improving the yield rate

Active Publication Date: 2018-07-20
RALEC TECH KUNSHAN LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chip resistors meet this requirement, but in the production process of thick film chip resistors with concave electrodes, in the traditional processing method, the electrode part of the resistor is printed on the surface of the product, but due to mass production, the relationship between resistors and resistors Frequent friction and collision between them will cause the electrodes on the product surface to fall off or be scratched, resulting in failure of the resistance value and affecting the product yield

Method used

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  • A production method of chip resistors avoiding failure of resistance value
  • A production method of chip resistors avoiding failure of resistance value
  • A production method of chip resistors avoiding failure of resistance value

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Experimental program
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Effect test

Embodiment 1

[0034] Embodiment 1: a kind of production method of the wafer resistor that avoids resistance value failure, it comprises the following steps:

[0035] Step C1: Printing of the conductor layer 20: Print the shape and position of the conductor to be printed on the front hole 10 of the substrate 1 by screen printing, and use a vacuum pump to suck the ink into the inner wall of the hole to a certain depth;

[0036] Step RS: printing the resistance layer: printing the required resistance shape and position on the front surface of the substrate by the screen plate through the printing machine, and the resistance layer 21 is overlapped with the conductor layer printed in step C1;

[0037] Step G1: printing the resistive layer protective layer: printing the resistive layer protective layer 22 on the semi-finished product after the step RS is completed by the screen plate through the printing machine; the resistive layer protective layer is covered on the resistive layer of the step RS...

Embodiment 2

[0045] Embodiment 2: The difference between this embodiment and Embodiment 1 is that in this embodiment, the thickness of the nickel-plated layer of each chip resistor is 5.0-6.0 μm; the thickness of the zinc-plated layer of each chip resistor It is 7.0-8.0 μm.

Embodiment 3

[0046] Embodiment 3: The difference between this embodiment and Embodiment 1 is that in this embodiment, the substrate 1 is a ceramic substrate, and the size of the substrate is (50-60)*(60-70) mm.

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PUM

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Abstract

The invention discloses a chip resistor production method capable of avoiding failure of a resistance value. The chip resistor production method comprises the following steps: C1, conductor layer printing; RS, resistor layer printing; G1, resistor layer protection layer printing; LT, laser cutting; G2, product protection layer printing; C4, back conductor printing; MK, character code marking, end silver-coating, grain cutting, electroplating and packaging. By means of the chip resistor production method provided by the invention, by adopting the drainage technology, electrodes are printed in a groove of a substrate, and then the sunken electrodes are unlikely to generate friction and collision, resulting in avoiding electrode removal and improving the yield.

Description

technical field [0001] The invention relates to the field of production of electronic components, in particular to a process method for chip resistors that avoid failure of resistance values. Background technique [0002] With the demand for miniaturization, high performance, high reliability, safety and electromagnetic compatibility of electronic equipment in the industrial and consumer electronics market, new requirements are constantly put forward for the performance of electronic circuits, and chip components are further developed towards miniaturization, Multi-layer, large-capacity, high-voltage resistance, integration and high-performance development. Chip resistors meet this requirement, but in the production process of thick film chip resistors with concave electrodes, in the traditional processing method, the electrode part of the resistor is printed on the surface of the product, but due to mass production, the relationship between resistors and resistors Frequent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00H01C17/28
CPCH01C17/006H01C17/281
Inventor 邵群峰
Owner RALEC TECH KUNSHAN LTD