Device and method for improving corrosion uniformity of chip
A uniformity and wafer technology, which is applied in the field of devices to improve the uniformity of wafer corrosion, can solve the problem of high corrosion rate of chemical liquid, and achieve the effect of improving corrosion uniformity and uniformity
Active Publication Date: 2016-05-04
BEIJING SEVENSTAR ELECTRONICS CO LTD
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[0004] The object of the present invention is to provide a device and method for improving the uniformity of wafer corrosion, so as to solve the problem that the corrosion rate of chemical liquid at the starting point is higher than that of other parts of the wafer, and improve the uniformity of wafer corrosion.
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[0024] In order to make the purpose, technical solution and advantages of the present invention clearer, the following will further describe the implementation of the present invention in detail in conjunction with the accompanying drawings. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0025] The above and other technical features and beneficial effects will be described in detail in conjunction with the embodiments and the accompanying drawings to describe the semiconductor device with the metal gate electrode and the manufacturing method thereof proposed by the present ...
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The invention discloses a device and method for improving corrosion uniformity of a chip. The device comprises a first spraying arm and a first spraying device, wherein the first spraying device is arranged on the first spraying arm capable of driving the first spraying device to rotate and / or lift, the length of the first spraying arm is consistent with the radius or diameter of the chip, and a chemical liquid sprayed from the first spraying device can instantly and simultaneously cover the surface of the chip. By arranging the first spraying device, the chemical liquid can instantly and simultaneously cover the surface of the chip with the high-speed rotation state of the chip during spraying the chemical liquid, so that all parts of the surface of the chip simultaneously react with the chemical liquid, the problem that the corrosion rate at an initial spraying point of the chemical liquid is higher than those of other parts of the chip in the prior art is solved, and the corrosion uniformity of the chip is improved; and further, during the chip corrosion process, the corrosion rate of the chip also can be accurately controlled by adjusting the swinging rate of a second spraying device, and the corrosion uniformity of the chip is further improved.
Description
technical field [0001] The invention relates to the field of semiconductor devices and processing and manufacturing, and more specifically relates to a device and method for improving uniformity of wafer corrosion. Background technique [0002] With the continuous shrinking of the feature size of integrated circuits, the requirements for the cleanliness and flatness of the oxide film on the surface of the wafer are getting higher and higher. If the thickness of the oxide film on the surface of the wafer exceeds the limit, it will directly affect the quality of the subsequent process, resulting in the failure of the integrated circuit chip. The performance deteriorates and the product yield rate decreases. Although the flatness of the oxide film can be controlled by changing the conditions of the oxidation process, the uniformity of the film thickness of the wafer still needs to be further improved after this process. Monolithic wet etching has become a very important techno...
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IPC IPC(8): H01L21/67
CPCH01L21/6708
Inventor 刘伟许璐
Owner BEIJING SEVENSTAR ELECTRONICS CO LTD