High in composition ingan/gan quantum well structure solar cell based on self-supporting gan substrate and its preparation method
A solar cell, self-supporting technology, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of difficult to obtain high-quality high-In composition InGaN thin films, high defect density, high In composition and high quality, etc. Efficiency, the effect of expanding the light absorption range
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Embodiment 1
[0034] A self-supporting GaN substrate 1, the substrate is gallium nitride material, the size of the gallium nitride self-supporting wafer used is 20.0mm×20.5mm (±0.2mm), the thickness is 350±25μm, and the crystal orientation is C-plane(0001)±1 0 , TTV≤15μm, bending degree BOW≤20μm, conductivity type is N type, resistivity 5 cm -2 , effective area>90%. The use of gallium nitride substrates can reduce the lattice mismatch and thermal mismatch between the substrate and the epitaxial layer.
[0035] A GaN buffer layer 2, the gallium nitride buffer layer is fabricated on the self-supporting GaN substrate 1, the GaN buffer layer is grown by RF-MBE method, the growth temperature is 500°C, the thickness is 20nm, the gallium nitride buffer layer Layer 2 provides nucleation centers for the subsequent growth of n-type doped GaN layer materials.
[0036] An n-type doped GaN layer 3, the n-type doped GaN layer 3 is fabricated on the gallium nitride buffer layer 2, and the doped GaN buf...
Embodiment 2
[0043] A self-supporting GaN substrate 1, the substrate is gallium nitride material, the size of the gallium nitride self-supporting wafer used is 20.0mm×20.5mm (±0.2mm), the thickness is 350±25μm, and the crystal orientation is C-plane(0001)±1 0 , TTV≤15μm, bending degree BOW≤20μm, conductivity type is N type, resistivity 5 cm -2 , effective area>90%. The use of gallium nitride substrates can reduce the lattice mismatch and thermal mismatch between the substrate and the epitaxial layer.
[0044] A GaN buffer layer 2, the gallium nitride buffer layer is fabricated on the self-supporting GaN substrate 1, the GaN buffer layer is grown by RF-MBE method, the growth temperature is 500°C, the thickness is 15nm, the gallium nitride buffer layer Layer 2 provides nucleation centers for the subsequent growth of n-type doped GaN layer material.
[0045] An n-type doped GaN layer 3, the n-type doped GaN layer 3 is fabricated on the gallium nitride buffer layer 2, and the doped GaN buff...
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