Method and apparatus for profile and surface preparation of retaining rings for use in chemical mechanical polishing processes

Abstract

A fixture for forming a sacrificial surface on a retaining ring comprising: a fixture plate sized to substantially match the outer diameter of the retaining ring; and clamping means adapted to provide A side load is applied to one of the inner diameter sidewall or the outer diameter sidewall of the lower portion of the retaining ring.

Description

technical field [0001] Embodiments of the present disclosure relate to polishing systems for polishing substrates, such as semiconductor substrates. More specifically, embodiments relate to retaining rings useful in chemical mechanical planarization (CMP) systems. Background technique [0002] Chemical mechanical polishing (CMP) is a process commonly used in the manufacture of high density integrated circuits to planarize or polish layers of material deposited on a substrate. The carrier head may provide the substrate held therein to a polishing station of the CMP system and controllably push the substrate against the moving polishing pad. CMP is effectively utilized by providing contact between feature sides of the substrate and moving the substrate relative to the polishing pad in the presence of a polishing fluid. Material is removed from the feature side of the substrate in contact with the polishing surface by a combination of chemical and mechanical activity. Partic...

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Problems solved by technology

However, this method is inefficient due to high capital and labor costs

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