Packaging device and method of thin-wall type dry electronic transformer
A technology for electronic transformers and packaging devices, applied in transformer/inductor parts, transformer/inductor shells, circuits, etc., can solve the problems of coil skew, affecting the thickness of transformer packaging, uneven polishing, etc.
Active Publication Date: 2016-05-11
BEIJING XINLI MACHINERY
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- Application Information
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Problems solved by technology
Pads with a thickness of less than 1mm are difficult to prepare, and in order to ensure the adhesion between the pad and the packaging material, many pads are polished and passivated. Due to uneven grinding, the coil is easily skewed and not in a horizontal position. Thus affecting the package thickness of the transformer
In the prior art, at least there are defects such as coil skewing and unevenness, leaking enameled wire, uneven package thickness, etc.
Method used
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Embodiment Construction
[0014] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0015] A packaging device for a thin-walled dry-type electronic transformer includes an upper cover plate 1, a side plate 5 and a lower base plate 4, and the upper cover plate 1, the side plates 5 and the lower base plate 4 are used together to realize the packaging of the electronic transformer. The upper cover plate 1 has a protruding part, and the protruding part cooperates with the hollow position of the side plate 5, and makes the upper part of the side plate 5 adhere to the outer peripheral wall of the protruding part. The lower bottom plate 4 has an outer flange, and the inner peripheral wall of the outer flange is in close contact with the lower part of the s...
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Abstract
The invention discloses a packaging device of a thin-wall type dry electronic transformer. The packaging device comprises an upper cover plate, side plates and a bottom plate; the electronic transformer is packaged through match usage of the upper cover plate, the side plates and the bottom plate; the upper cover plate is equipped with lug bosses; the lug bosses of the upper cover plate match with the hollow positions of the side plates; the upper parts of the side plates attach on the peripheral walls of the lug bosses; the bottom plate is equipped with outward flanges; the inner peripheral walls of the outward flanges attach on the lower parts of the side plates; a packaging opening and vent holes are arranged on the upper cover plate; the packaging opening is used for importing a raw packaging material; and the upper cover plate, the side plates and the bottom plate form a packaging cavity.
Description
technical field [0001] The invention relates to the field of packaging technology, in particular to a packaging device and method for a thin-walled dry-type electronic transformer. Background technique [0002] Encapsulation is an integral part of dry-type electronic transformers. In order to ensure that the coils are in the required position in the transformer, the coils are padded up by packaging pads of different specifications. Pads with a thickness of less than 1mm are difficult to prepare, and in order to ensure the adhesion between the pad and the packaging material, many pads are polished and passivated. Due to uneven grinding, it is easy to cause the coil to be skewed and not in a horizontal position. Thus affecting the package thickness of the transformer. In the prior art, at least there are defects such as coil skewing and unevenness, leaking enameled wire, and uneven packaging thickness. Contents of the invention [0003] The object of the present invention ...
Claims
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IPC IPC(8): H01F27/02H01F41/04
CPCH01F27/022H01F41/04
Inventor 陈斌
Owner BEIJING XINLI MACHINERY