Method and apparatus for manufacturing flexible substrate
A technology for substrates and air extraction devices, which is applied in the fields of printed circuit manufacturing, semiconductor/solid-state device manufacturing, electrical components, etc., and can solve the problems of flexible substrates that are not easy to peel off the bottom plate
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[0075] The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the patent scope of the application and the accompanying drawings , any person skilled in the art can easily understand the related objects and advantages of the present invention. The following examples further illustrate the concept of the present invention in detail, but do not limit the scope of the present invention in any way.
[0076] In the following description, words such as first, second, and third are used to distinguish different elements, components, and regions in the drawings. These terms are not intended to limit elements, components, or regions. That is to say, without departing from the spirit and scope of the presen...
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