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LED chip integrated packaging module and packaging method

A LED chip and integrated packaging technology, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of limiting the chip point spacing and the inability to form densely packed chips.

Active Publication Date: 2017-11-17
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the volume of the bracket itself of this packaging module will limit the chip point spacing, and it is impossible to form a chip densely packed

Method used

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  • LED chip integrated packaging module and packaging method
  • LED chip integrated packaging module and packaging method
  • LED chip integrated packaging module and packaging method

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0020] Currently commonly used as figure 1 and figure 2 The traditional multi-color packaging module shown is usually composed of chips 1.8 of three light colors, and multiple modules are then spliced ​​to form a module. The three kinds of chips 1.8 lead the chip electrodes to the electrode point 1.3 on the edge of the support through the gold wire 1.2 or the substrate circuit 1.6. The support can be divided into a support 1.5 with a line 1.6 and a support 1.1 without a line. However, the volume of the bracket itself of the packaging module will limit the chip point spacing, and it is impossible to form a dense chip arrangement. However, the present invention performs circuit conversion between circuit board layers thr...

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PUM

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Abstract

The invention discloses a light emitting diode (LED) chip integration package module and package method. The package module comprises multiple groups of light emitting units, a first circuit substrate, a second circuit substrate and a package material, wherein the multiple groups of light emitting units are integrated on the first circuit substrate, adjustment circuits and metal ball arrays are arranged on the first circuit substrate and the second circuit substrate, the metal ball array on the first circuit substrate is a specially-shaped metal array, the metal ball array on the second circuit substrate is a regular array, the second circuit substrate is used for re-arranging the specially-shaped metal array on the first circuit substrate onto the regular metal ball array at the bottom of the second circuit substrate by the adjustment circuit on the second circuit substrate, and the package material is used for packaging the multiple groups of light emitting units, the first circuit substrate and the second circuit substrate.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to an LED chip integrated package module and a package method. Background technique [0002] With the continuous shrinking of the chip pitch and circuit pitch in LED devices, the volume of the light source module is also decreasing day by day, and the integrated packaging is more convenient for testing and installation operations. The traditional integrated packaging of light-emitting diodes is mostly densely arranged with multiple chips and connected in series with gold wires, so the production efficiency is not high. Another disadvantage of this large-area integrated packaging form is that it is easy to affect the entire light source due to damage to one chip, and only the entire light source module can be replaced, which cannot be replaced in a small area, which undoubtedly increases the maintenance cost of LED lamps. . In addition, currently commonly used f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/62
CPCH01L25/0753H01L33/62H01L2933/0066
Inventor 刘立莉杨华于飞李璟伊晓燕王军喜李晋闽
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI