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SMD type LED package device, method for manufacturing the same, and light-emitting apparatus

一种LED封装、制作方法的技术，应用在电气元件、电固体器件、半导体器件等方向，能够解决弯折次数累加等问题

Active Publication Date: 2016-05-18
POWERLED ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this design, it is necessary to bend the metal lead frame into a three-dimensional standing shape, and more bending times bring about the accumulation of tolerances

Method used

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  • SMD type LED package device, method for manufacturing the same, and light-emitting apparatus
  • SMD type LED package device, method for manufacturing the same, and light-emitting apparatus
  • SMD type LED package device, method for manufacturing the same, and light-emitting apparatus

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Embodiment Construction

[0072] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the drawings.

[0073] refer to image 3 The light-emitting device of the present invention includes a circuit substrate 8 and an SMT type LED packaging component 1 assembled on the circuit substrate 8 by a surface mount (SMT) process. The number of LED packaging components 1 in the light emitting device is not limited to a single one, and the number and arrangement are different depending on the actual application. For example, when the light-emitting device is an electronic billboard, there are multiple LED packaging components 1 arranged in an array; when the light-emitting device is a flashlight or a lamp, there are single or multiple LED package components 1 arranged at intervals.

[0074] The first embodiment of the SMT type LED packaging component 1 of the present inven...

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PUM

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Abstract

Disclosed is a SMD type LED package device, a method for manufacturing the same, and a light-emitting apparatus, wherein the surface-mount-device (SMD) type light-emitting diode (LED) package device comprises an assembly of an LED chip, two metal supporting frames, and a packaging body. The two metal supporting frames of the assembly are spaced apart from each other and disposed in parallel along the first axis. Each metal supporting frame has a first end electrically connected to the LED chip and a second end opposite to the first end. The packaging body has a lens portion and a supporting portion, which is integrally formed with the packaging body and covers the LED chip and the first ends of the metal supporting frames. The SMT type LED package device is provided with vertical characteristics, and is suitable for the SMT production process.

Description

technical field [0001] The present invention relates to a light-emitting device, in particular to a light-emitting device with a light-emitting diode (LED) packaging component suitable for assembly by surface mount technology (SMT), the LED packaging component and a manufacturing method of the LED packaging component. Background technique [0002] refer to figure 1 A traditional LED packaging component 9 includes two metal lead frames 911, 912, an LED chip 92 mounted on one of the metal lead frames 911 and electrically connected to the other metal lead frame 912 with metal wires, and a casting The packaging body 93 of the LED chip 92 is shaped and covered. [0003] Cooperate with reference figure 2 , the manufacturing method of the aforementioned traditional LED packaging component, comprising the following steps: [0004] S91—get a mold 94 with a mold cavity 940; [0005] S92—perfusion encapsulation colloid 95; [0006] S93—insert the combination of the metal lead fra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48
CPCH01L33/486H01L2933/005H01L33/483H01L33/54H01L33/62H01L2224/48247H01L2924/181H01L2933/0033H01L2924/00012
Inventor 许维彬林德扬
Owner POWERLED ELECTRONICS