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Loudspeaker module

A speaker mold and basin frame technology, applied in the direction of electrical components, sensors, etc., can solve the problems of poor terminal elasticity, large circuit board area, complex manufacturing process, etc., achieve simple and stable manufacturing process, save circuit board area, and reduce costs.

Inactive Publication Date: 2016-05-25
KUNSHAN JIAHUA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The speaker module mainly consists of a basin frame, magnetic steel, terminals, sound film, voice coil, front cover, wiring board, damping cloth, etc. Some existing speaker module terminals can only be positioned in the basin frame by assembly. , the manufacturing process is relatively complicated, and although the terminals of some speaker modules are embedded in the basin frame by integral injection molding with the basin frame, the elasticity of the terminals is not good, and the large volume requires a large circuit board area

Method used

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Embodiment Construction

[0020] The present invention will be described in detail below in conjunction with various embodiments shown in the drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0021] see Figure 1 to Figure 3 As shown, the present invention provides a speaker module 100 , which includes a frame 1 and a pair of elastic pieces 2 fixed to the frame 1 , wherein the frame 1 and the pair of elastic pieces 2 are integrally injection molded.

[0022] The basin frame 1 is frame-shaped, which is made of plastic insulating material, and has a front frame 11, a rear frame 12, and a pair of side frames 13 connecting the front frame 11 and the rear frame 12. , where the two side frames 13 are respectively provided with slots 131 at the ends connected to the front frame 11, the slots 131 are formed by ...

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Abstract

The invention provides a loudspeaker module. The module comprises a frame-shaped basin stand and a pair of shrapnels fixed at two sides of the top of the basin stand. The basin stand and the pair of shrapnels are formed by integral injection moulding; the pair of shrapnels are symmetrically arranged at two sides of the basin stand; each shrapnel comprises a horizontally arranged fixing part and an elastic part integrated with the fixing part; and the elastic parts are bended in S shapes upwards from the front ends of the fixing parts. According to the loudspeaker module, the basin stand is integrally moulded and occupies relatively small circuit board area; therefore, the space is saved; the shrapnel material is saved; the cost is saved; and the manufacturing process is simple and reliable.

Description

technical field [0001] The invention relates to a horn module. Background technique [0002] The horn, also known as the loudspeaker, is an electroacoustic converter that converts current signals into sound signals through certain physical effects. When different electronic energies are transmitted to the voice coil of the speaker, the voice coil generates an energy that interacts with the magnetic field of the magnet. This interaction causes the drum paper to vibrate. Because the electronic energy changes at any time, the voice coil of the speaker will move forward or backward , so the drum paper of the horn will move accordingly, and this action changes the density of the air to produce sound. [0003] In recent years, the structure of the speaker tends to be miniaturized and thinned to be used in mobile phones, walkie-talkies, notebook computers, tablet computers, etc. Therefore, the performance and structure requirements of the components used in the speaker module are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/06H04R9/02H04R2209/00
Inventor 王中
Owner KUNSHAN JIAHUA ELECTRONICS