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Printed circuit board (PCB) structure with high heat conduction and dissipation

A technology of PCB board and heat dissipation, applied in the field of PCB board structure, can solve the problems of PCB board damage and poor heat dissipation of PCB board, and achieve the effect of reducing damage, providing heat dissipation and thermal conductivity, and strong thermal conductivity and heat dissipation.

Inactive Publication Date: 2016-05-25
广德英菲特电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Nowadays, the PCB boards produced by enterprises generally have poor heat dissipation. During the use of PCB boards, the PCB boards are often damaged due to overheating problems. Therefore, there is an urgent need for a PCB board structure with strong heat dissipation in the market.

Method used

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  • Printed circuit board (PCB) structure with high heat conduction and dissipation

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Embodiment Construction

[0015] see figure 1 , is a specific embodiment of the present invention:

[0016] A PCB board structure with strong heat conduction and heat dissipation, the PCB board includes a first substrate 1 and a second substrate 2, a heat dissipation plate is arranged between the first substrate and the second substrate, and the surface of the heat dissipation plate is covered with a graphite sheet 4; the first substrate The surface of the second substrate is covered with a heat dissipation material.

[0017] The heat dissipation plate is a mesh heat dissipation plate 3 . The mesh cooling plate is made of thermal silica gel. The graphite sheet is provided with several through holes. The heat dissipation material is nano carbon heat dissipation film.

[0018] Through the PCB board structure with strong heat conduction and heat dissipation of the present invention, the heat dissipation and thermal conductivity of the PCB board can be greatly improved, and the damage of the PCB board ...

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Abstract

The invention relates to a printed circuit board (PCB) structure with high heat conduction and dissipation. The PCB comprises a first substrate and a second substrate, wherein a cooling plate is arranged between the first substrate and the second substrate, graphite flakes cover the surfaces of the cooling plate, and cooling materials cover the surfaces of the first substrate and the second substrate. By the PCB structure with high heat conduction and dissipation, the heat dissipation and conduction performance of the PCB can be greatly improved, and the situation that the PCB is damaged caused by an overheating problem is reduced.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a PCB board structure with strong heat conduction and heat dissipation. Background technique [0002] Nowadays, the PCB boards produced by enterprises generally have poor heat dissipation. During the use of PCB boards, the PCB boards are often damaged due to overheating problems. Therefore, there is an urgent need for a PCB board structure with strong heat dissipation in the market. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a PCB board structure with strong heat conduction and heat dissipation. [0004] The technical scheme that the present invention adopts for solving the problems of the technologies described above is: [0005] A PCB board structure with strong heat conduction and heat dissipation, the PCB board includes a first substrate and a second substrate, a heat dissipation plate is arranged between th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0207H05K2201/06
Inventor 瞿德军周文科
Owner 广德英菲特电子有限公司