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Fitting equipment

A laminating equipment and laminating device technology, applied in lamination auxiliary operations, chemical instruments and methods, lamination, etc., can solve problems affecting production efficiency and yield, labor intensity of workers, and low production efficiency. Achieve good utilization rate, improve work efficiency and yield effect

Active Publication Date: 2017-09-26
JINCHENG FUTAIHUA PRECISION ELECTRONICS CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the existing production methods are completed by simple equipment and manual work, which has low production efficiency and high labor intensity for workers.
In addition, how to set the position of each device in the laminating equipment and the sequence of processing procedures in the fully automatic laminating equipment will also affect the efficiency and yield of production

Method used

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Experimental program
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Embodiment Construction

[0019] see figure 1 and figure 2 , the bonding equipment 100 according to the embodiment of the present invention is used to bond the first component 200 and the second component 300 . The first element 200 and the second element 300 may be glass plates used to manufacture touch panels and liquid crystal displays, or elements used to manufacture devices such as semiconductors, or other elements that need to be hermetically bonded. In this embodiment, the first element 200 and the second element 300 are glass plates. A protective film (not shown) is pasted on the first element 200 and the second element 300 .

[0020] The bonding device 100 includes a base 10 . The base 10 is fixed with a material storage and feeding device 20, a film tearing device 30, a positioning mechanism 40, a material shifting and unloading mechanism 50, a turntable 60, four loading tables 70 arranged on the turntable 60, and an imaging alignment device 80 and vacuum bonding device 90. The film tea...

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PUM

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Abstract

A laminating device is used for laminating a first element and a second element; the laminating device includes a base, a material storage and feeding device arranged on the base, a first film tearing device, a positioning mechanism, a material transferring mechanism, a rotary disc, a plurality of material bearing stages arranged on the rotary disc, a second film tearing device, a vacuum laminating device and a material dropping mechanism. According to the laminating device, a film of the first element fed by the material storage and feeding device is stripped by the first film tearing device; the second element is positioned and fixed by the positioning mechanism; the first element having the film stripped and the second element after positioning are transferred and placed on the material bearing stages by the material transferring mechanism; the rotary disc drives the first element and the second element on the material bearing stages sequentially to be close to the second film tearing device, the vacuum laminating device and the material dropping mechanism, and film stripping of the second element, laminating of the first element and the second element and material dropping of the laminated first element and second element are performed.

Description

technical field [0001] The invention relates to a bonding device, in particular to a bonding device for manufacturing a display panel. Background technique [0002] In the process of manufacturing liquid crystal display panels or touch panels, two substrates need to be bonded in a vacuum bonding device. Usually, after the substrate is processed, a protective film is pasted on its surface to protect its appearance, and the protective film is torn off by a film tearing device before bonding. Most of the existing production methods are completed by simple equipment and labor, which has low production efficiency and high labor intensity for workers. In addition, how to set the position of each device in the laminating equipment and the sequence of processing procedures in the fully automatic laminating equipment will also affect the efficiency and yield of production. Contents of the invention [0003] In view of the above situation, it is necessary to provide a bonding equi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B38/10
Inventor 蔡子琦李建军余芝明
Owner JINCHENG FUTAIHUA PRECISION ELECTRONICS CO LTD
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