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Processing method of metal carrier and package substrate

A technology of metal carrier and packaging substrate, which is applied in the manufacture of electric solid-state devices, semiconductor devices, semiconductor/solid-state devices, etc., and can solve problems such as equipment damage, separation layer potion pollution, and high production costs

Active Publication Date: 2016-06-01
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, using PP and ultra-thin copper foil to make the carrier, the production cost is too high, and the liquid is easy to enter between the ultra-thin copper foils, resulting in the risk of yield decline and equipment damage. The separation layer causes liquid pollution, and the application narrow range

Method used

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  • Processing method of metal carrier and package substrate
  • Processing method of metal carrier and package substrate
  • Processing method of metal carrier and package substrate

Examples

Experimental program
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Embodiment 1

[0041] Please refer to figure 2 , an embodiment of the present invention provides a metal carrier processing method, which may include:

[0042] 201. Select a metal carrier;

[0043] see image 3 , in the embodiment of the present invention, the metal carrier 300 is directly selected for processing, and the metal carrier 300 is a metal carrier whose main component is Ni.

[0044] Optionally, the selected metal carrier 300 includes:

[0045] The ten-point height Rz of the microscopic roughness of the metal carrier 300 is less than 10 um, the arithmetic mean deviation Ra of the profile is less than 3 um, and the main component of the metal carrier 300 is Ni.

[0046] It should be noted that, generally, Ra is between 0.1-0.3um, and Rz is preferably between 1.0-2.0um, which is not specifically limited here.

[0047] Optionally, the selected metal carrier 300 includes:

[0048] The thickness of the metal carrier 300 is less than 1mm.

[0049] Different from the prior art, in...

Embodiment 2

[0073] In order to facilitate better implementation of the above-mentioned related methods in the embodiments of the present invention, related devices for cooperating with the above-mentioned methods are also provided below.

[0074] An embodiment of the present invention also provides a packaging substrate, which may include:

[0075] Metal carrier, the thickness of the metal carrier is less than 1mm, and the composition of the metal carrier includes stainless steel or tinplate;

[0076] The metal carrier is provided with a first metal layer and a second metal layer;

[0077] The thickness of the first metal layer is between 0.01-1um; the thickness of the second metal layer is between 3-10um; the composition of the first metal layer and the second metal layer includes copper.

[0078] Since the metal carrier included in the package substrate corresponds to the first method embodiment above, reference may be made to the first method embodiment above, and details will not be ...

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Abstract

The invention discloses a processing method of a metal carrier. The metal carrier is used for fabricating a package substrate and solving the problems in a carrier fabricated in the prior art. The method comprises the following steps: selecting the metal carrier; cleaning the metal carrier; sputtering the metal carrier on a first metal layer; and arranging a second metal layer on the metal carrier and finishing processing of the metal carrier.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a metal carrier processing method and a packaging substrate. Background technique [0002] With the development of integrated circuit (IC) technology, the number of pins has increased, the wiring density has increased, and the number of substrate layers has increased. In recent years, the trend towards thinner and miniaturized devices requires thinner line spacing and smaller apertures. Therefore, Embedded Print Process (EPP) technology came into being. This technology can solve the current trend of thinning and high density circuit board development, but the application of this process must require the support of a peelable carrier. Now Some technical solutions are as follows: [0003] At present, in the embedded processing technology of the packaging substrate, the carrier is made by laminating the prepreg (Polypropylene, PP) and two layers of ultra-thin copper foil, wh...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/48
Inventor 付治屯刘德波丁鲲鹏孔令文
Owner SHENNAN CIRCUITS