Wafer transfer control method in multi-station chemical mechanical polishing system
A technology of chemical machinery and control methods, which is applied in the direction of grinding/polishing equipment, manufacturing tools, grinding machine tools, etc., can solve the problems of reducing production efficiency, affecting continuous process, and single control environment, so as to improve production efficiency, good and reliable The effect of sex and applicability
Active Publication Date: 2018-01-12
TSINGHUA UNIV +1
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Problems solved by technology
If there is no effective wafer transfer control, it is easy to reduce production efficiency, and may even affect the continuous progress of the entire process
However, the control environment for the related control technology is relatively simple, and it is only suitable for specific system composition and structure.
Method used
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[0019] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
[0020] A method for controlling wafer transfer in a multi-station chemical mechanical polishing system according to an embodiment of the present invention will be described below with reference to the accompanying drawings.
[0021] figure 1 It is a flowchart of a method for controlling wafer transfer in a multi-station chemical mechanical polishing system according to an embodiment of the present invention.
[0022] Such as figure 1 As shown, the method for controlling wafer transfer in the multi-station chemical mechanical po...
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The invention discloses a control method for wafer conveyance in a multi-station chemical mechanical polishing system. The control method comprises the steps of calculating the station score of each station on line through the score addition and subtraction method; determining the wafer-taking station according to the station score of each station; informing a manipulator to take wafers from the wafer-taking station and conveying the wafers to the next machining station according to the principle of proximity for placing the wafers. According to the control method, the wafer-taking station is determined according to the station score of each station, and therefore the wafers can be conveyed to the next machining station in time, the whole process can be conducted continuously, and the production efficiency of the chemical mechanical polishing system can be improved.
Description
technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a method for controlling wafer transmission in a multi-station chemical mechanical polishing system. Background technique [0002] CMP (Chemical Mechanical Polishing, chemical mechanical polishing) technology is one of the key technologies for preparing multi-layer copper interconnection structures in integrated circuit manufacturing. As the most effective global planarization method, CMP technology uses chemical etching and mechanical grinding The synergistic effect of the wafer can effectively take into account the local and global flatness of the wafer, and has been widely used in the manufacture of VLSI. Today, CMP equipment has developed into a multi-station integrated system with the polishing unit as the main body, which integrates cleaning, drying and automatic sheet transfer technologies. [0003] In the continuous production process, each wafer pa...
Claims
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IPC IPC(8): B24B37/34B24B27/00H01L21/677
CPCB24B27/0023B24B37/345H01L21/67703
Inventor 李弘恺吴云龙刘乐田芳馨林达义王同庆李昆路新春
Owner TSINGHUA UNIV