A kind of preparation method of heat dissipation device for laser display

Abstract

The invention discloses a heat dissipation device for laser display and a preparation method thereof. The heat dissipation device comprises a heat conduction substrate (1), heat dissipation fins (2) and an ultra-thin composite heat conduction coating (3). Among them, the ultra-thin composite thermally conductive coating is composed of reduced graphene oxide, thermally conductive silver nanoparticles, zinc oxide nanoparticles, and conductive polymers in a certain proportion. The present invention forms zinc oxide-graphene composite porous structure by doping zinc oxide nanoparticles in reduced graphene oxide through high-temperature reaction, increases the specific surface area of ​​its film, and makes it have ultra-high thermal conductivity and heat dissipation At the same time, adding small-sized heat-conducting silver nanoparticles to fill the graphene defects in the film makes the heat-conducting effect of the film uniform; secondly, adding a conductive polymer increases the viscosity of the raw material solution of the heat-conducting film and improves the thermal conductivity of the film. The interface matching of the heat-conducting substrate makes the flatness of the film better after preparation, which improves the matching with the heat source.

Description

technical field [0001] The invention relates to the field of heat dissipation for electronic components with high calorific value in laser display, in particular to a preparation method of a heat dissipation device for laser display. Background technique [0002] With the rapid development of microelectronics technology, the integration of electronic products in the field of microelectronics is getting higher and higher, and the power consumption is also increasing. Electronic components have a huge impact, which greatly restricts the performance and service life of electronic components, and has become an urgent problem to be solved. [0003] At present, in order to solve the heat dissipation requirements of various high-heat-generating electronic components, metal heat sinks or heat sinks with high thermal conductivity, such as copper and aluminum, are mostly mounted on the surface of electronic components to evenly dissipate the heat inside the electronic components. But...

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Problems solved by technology

[0006] The invention provides a method for preparing a heat dissipation device for laser display. By spraying an ultra-thin composite heat conduction coating on the surface of a heat conduction substrate and heat dissipation fins, the complex preparation process and high preparation cost in the prior art are solved. , The specific surface area of ​​the graphene film is small, the thermal conductivity is poor, the adhesion and flatness of the film are poor, and the size of the heat sink and the heat dissipation performance cannot be considered. Technical problems such as

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