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High multi-layer PCB and laminating method thereof

A kind of PCB board, high multi-layer technology, applied in the field of high multi-layer PCB board and its lamination, it can solve the problems of poor glue filling, uneven plate thickness lamination, sliding plate, etc., to ensure reliability and improve interlayer The effect of alignment

Active Publication Date: 2016-06-15
KINWONG ELECTRONIC TECH (ZHUHAI) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a high-layer PCB board and its pressing method, aiming at solving the problem that the riveting is not firm when the existing pressing method is applied to the high-layer PCB board, During the lamination process, problems such as slippery boards, uneven lamination of plate thickness, and unreliable glue filling occurred.

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  • High multi-layer PCB and laminating method thereof

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Embodiment Construction

[0027] The present invention provides a high-layer PCB board and its lamination method. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] see figure 1 , figure 1 A flow chart of a preferred embodiment of a high-layer PCB lamination method provided by the present invention, as shown in the figure, includes steps:

[0029] S1. Cutting: Select double-sided core board, PP and copper foil, and cut according to the design size;

[0030] S2. Drilling: use a drilling machine to drill a plurality of positioning holes for the above PP and copper foil for positioning during pressing;

[0031] S3, making the inner layer graphics: the above-mentioned double-sided core board is processed according to the desig...

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Abstract

The invention discloses a high multi-layer PCB and a laminating method thereof. The laminating method of the high multi-layer PCB disclosed by the invention is suitable for the high multi-layer PCB of which the number of layers is greater than or equal to 30. According to the high multi-layer PCB and the laminating method thereof, double-sided core veneers are fixed on an FR4 cover plate and a steel plate through pins, so that the problems of plate sliding, wrinkling and the like during the laminating process of the high multi-layer board are effectively solved, the layer-to-layer registration is improved, and the reliability is well guaranteed.

Description

technical field [0001] The invention relates to the field of PCBs, in particular to a high-layer PCB board and a pressing method thereof. Background technique [0002] Ordinary multi-layer PCB boards, before lamination, use rivets to rivet the core board and prepreg (PP) together, and then stack the boards in the order of steel plate-copper foil-PCB board-copper foil-steel plate. After that, it can enter the press for hot pressing. Since the general thickness of ordinary multi-layer PCB boards is ≤3.0mm, the problem of inaccurate alignment can be solved by riveting (or adding a few more riveting positions). [0003] However, for high-layer PCB boards, since the number of layers is as high as 40, multiple core boards need to be riveted together, and the total thickness of the pressing is about 8.0mm. The traditional pressing method will make the riveting of the core board weak. , During the lamination process, problems such as slippery boards, uneven lamination of board thi...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4623H05K3/4638H05K2203/068
Inventor 付凤奇王俊张霞曾平何新荣陆玉婷
Owner KINWONG ELECTRONIC TECH (ZHUHAI) CO LTD