Probe head and upper guider plate
A probe head and guide plate technology, used in instruments, measuring devices, electronic circuit testing, etc., can solve the problems of inaccurate positioning, probe damage, and low probe head assembly efficiency, so as to prevent probe damage and improve assembly. The effect of efficiency
Inactive Publication Date: 2016-08-10
MPI CORP
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Problems solved by technology
For example, under the requirement of fine spacing, the through-holes on the probe and the upper guide plate will become smaller and smaller; in addition, when the upper guide plate is opaque, and because of the tiny through-holes on the upper guide plate, As a result, the light cannot pass through the tiny through-holes on the upper guide plate, so the position of the probe needle tail cannot be directly and accurately observed. Only the position of the probe needle tail end and the through-hole on the opaque upper guide plate can be roughly observed, so it is impossible to accurately position
In this way, when the probe head is assembled, it is easy to cause damage to the probe, and it will also lead to low assembly efficiency of the probe head
Method used
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[0027] The structure and effect of the present invention will be described in detail by citing the following embodiments in conjunction with the accompanying drawings.
[0028] figure 1 It is a schematic structural diagram of a probe head according to an embodiment of the present invention. Please refer to figure 1 As shown, the probe head 100 of this embodiment is suitable for a vertical probe card. Specifically, as figure 1 As shown, the probe head 100 includes an upper guide plate 110 , a lower guide plate 120 , at least one positioning member 130 and a plurality of probes 140 . It should be particularly noted here that the probe head of the present invention is suitable for a test environment used on a vertical probe card, which means that it is used to provide a device under test (device under test, DUT for short) test, that is, the fine pitch is less than 400 microns (μm).
[0029] More specifically, in this embodiment, the upper guide plate 110 has a light transmit...
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The invention relates to a probe head and an upper guider plate, and is suitable for a vertical probe card. The probe head includes an upper guider plate, a lower guider plate and a plurality of probes. The upper guider plate has a plurality of upper through holes. The lower guider plate is located by one side of the upper guider plate and has a plurality of lower through holes. Each of the probes is positioned through one of the upper through holes of the upper guider plate and one of the lower through holes of the lower guider plate. The upper guider plate has a light transmittance of at least 75%, and is made of a material having a Moh's hardness of at least 5.
Description
technical field [0001] The invention relates to a probe head and an upper guide plate, in particular to a probe head and an upper guide plate suitable for a vertical probe card. Background technique [0002] Semiconductor integrated circuit chips usually use probe cards for electrical testing. The vertical probe card usually includes a printed circuit board, a space transformer board and a probe head, wherein the probe head is suitable for electrically connecting the circuit substrate to an object under test, and then performing an electrical test on the object under test. Specifically, the probe head at least includes an upper guide plate, a lower guide plate and a plurality of probes, and the upper guide plate and the lower guide plate of the probe head usually have a plurality of through holes. During the assembly of the probe head, it is necessary to pass each probe through the corresponding through hole in the upper guide plate and the lower guide plate, so as to align...
Claims
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IPC IPC(8): G01R31/28
CPCG01R1/07357G01R31/2889G01R31/2886
Inventor 许志豪林燊一陈永鑫
Owner MPI CORP