High-toughness packaging material

A packaging material and high toughness technology, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve the problems of insufficient heat resistance and poor toughness, and achieve high temperature resistance and mechanical strength Good, easy to use effect

Inactive Publication Date: 2016-08-17
SUZHOU JIN TENG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a high-toughness packaging mate...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Add 45g of dipropylene glycol diacrylate and 20g of maleic anhydride to 450g of methyl ethyl ketone, and reflux for 50 minutes; then add 1.8g of tetrazole and 7g of ethoxylated trimethylolpropane triacrylate, and reflux for 20 minutes; then Add 7.5g 1,3,5-triglycidyl-S-triazinetrione and 10g diethyl phosphite in sequence, and reflux for 2 hours; then add 7.5g cyanochitosan and 3.5g polydimethylsiloxane Oxane and 100 g of 2-hexanone were reacted under reflux for 1.5 hours, and finally 0.07 g of rubidium carbonate was added, and the reaction was continued for 1 hour to obtain an adhesive layer. The thickness of the vacuum-coated aluminum foil casting polyethylene film is 0.2 mm, and the thickness of the cyclopentadiene film layer is 1 mm; the vacuum aluminum foil casting polyethylene film and the cyclopentadiene film layer are glued together by hot pressing. The layers are bonded to obtain a high-toughness packaging material, which has strong tensile resistance and a heat...

Embodiment 2

[0010] Add 40g of dipropylene glycol diacrylate and 18g of maleic anhydride to 450g of methyl ethyl ketone, and reflux for 50 minutes; then add 1.5g of tetrazole and 6g of ethoxylated trimethylolpropane triacrylate, and reflux for 20 minutes; then Add 7g 1,3,5-triglycidyl-S-triazinetrione, 10g diethyl phosphite successively, and reflux reaction for 2 hours; then add 7g cyanochitosan and 3g polydimethylsiloxane and 100g of 2-hexanone was refluxed for 1.5 hours, and finally 0.065g of rubidium carbonate was added, and the reaction was continued for 1 hour to obtain an adhesive layer. The thickness of the vacuum-coated aluminum foil casting polyethylene film is 0.2 mm, and the thickness of the cyclopentadiene film layer is 1 mm; the vacuum aluminum foil casting polyethylene film and the cyclopentadiene film layer are glued together by hot pressing. The layers are bonded to obtain a high-toughness packaging material, which has strong tensile resistance and a heat-resistant temperat...

Embodiment 3

[0012] Add 42g of dipropylene glycol diacrylate and 19g of maleic anhydride to 450g of butanone, and reflux for 50 minutes; then add 1.6g of tetrazole and 6.5g of ethoxylated trimethylolpropane triacrylate, and reflux for 20 minutes; Then add 7.2g 1,3,5-triglycidyl-S-triazinetrione, 10g diethyl phosphite, and reflux reaction for 2 hours; then add 7.3g cyano-chitosan and 3.2g polydimethylsilane Oxane and 100 g of 2-hexanone were reacted under reflux for 1.5 hours, and finally 0.068 g of rubidium carbonate was added, and the reaction was continued for 1 hour to obtain an adhesive layer. The thickness of the vacuum-coated aluminum foil casting polyethylene film is 0.2 mm, and the thickness of the cyclopentadiene film layer is 1 mm; the vacuum aluminum foil casting polyethylene film and the cyclopentadiene film layer are glued together by hot pressing. The layers are bonded to obtain a high-toughness packaging material with strong tensile resistance and a heat-resistant temperatur...

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Abstract

The invention discloses a high-toughness packaging material which sequentially comprises an aluminum foil composite film layer, an adhesive layer and a cyclopentadiene film layer from inside to outside. The adhesive layer is prepared by the following steps: adding dipropanediol diacrylate and maleic anhydride into butanone, and reacting under reflux for 50 minutes; adding tetrazole and ethoxylated trimethylolpropane triacrylate, and reacting under reflux for 20 minutes; sequentially adding 1,3,5-triglycidyl-S-triazinyltrione and diethyl phosphite, and reacting under reflux for 2 hours; adding cyanochitosan, polydimethylsiloxane and 2-hexanone, and reacting under reflux for 1.5 hours; and finally, adding rubidium carbonate, continuing reacting for 1 hour to obtain the adhesive layer. By using the reasonable structural design and adhesive layer, the high-toughness packaging material disclosed by the invention has the advantages of favorable mechanical strength, high temperature resistance, favorable packaging protecting property, no pollution and the like, and is convenient to use.

Description

technical field [0001] The invention relates to the technical field of packaging materials, in particular to a high-toughness packaging material. Background technique [0002] Materials are the pillars of modern science and technology and social development, and the competition of modern high technology depends to a large extent on the development of material science. The so-called macromolecule usually refers to a macromolecular compound composed of tens of millions of small molecular compounds connected by chemical bonds. General-purpose polymer materials are divided into five categories: plastics, rubber, fibers, adhesives, and coatings. Composite materials are multiphase materials prepared by compounding two or more materials such as metal materials, ceramic materials or polymer materials. Various materials learn from each other in terms of performance and produce synergistic effects. The performance is superior to the original constituent materials and meets various r...

Claims

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Application Information

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IPC IPC(8): C09J135/02C09J11/04C09J11/06B32B27/08B32B27/32B32B7/12C08F222/14C08F222/06
CPCB32B7/12B32B27/08B32B27/32C08F222/1006C08F222/102C08L2205/03C09J11/04C09J11/06C09J135/02C08L5/08C08L83/04C08K13/02C08K5/524C08K3/26C08F222/06
Inventor 孙政良
Owner SUZHOU JIN TENG ELECTRONICS TECH
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