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Special heat conducting glue

A technology of thermally conductive adhesive and thermally conductive filler, applied in the direction of adhesives, adhesive types, amide/imide polymer adhesives, etc., can solve the problems of low stability, high density, low thermal conductivity, etc., and achieve stable Good properties, good thermal conductivity and strong bonding ability

Inactive Publication Date: 2016-09-07
周淑华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the development of traditional thermal adhesives also encountered some bottlenecks, such as low thermal conductivity, high density, and low stability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] A special heat-conducting glue according to the present invention provides a special heat-conducting glue, including polyacrylate, organic silica gel, sodium silicate, heat-conducting filler, polyvinyl alcohol and polyacrylamide, and its raw material components are calculated by weight. 10-20 parts of polyacrylate, 20-30 parts of organic silica gel, 20-30 parts of sodium silicate, 10-15 parts of thermal conductive filler, 15-20 parts of polyvinyl alcohol, and 10-18 parts of polyacrylamide.

[0012] As a preference, the special heat-conducting adhesive is characterized in that: its raw material components include 20 parts of polyacrylate, 30 parts of organic silica gel, 30 parts of sodium silicate, 15 parts of heat-conducting filler, and 20 parts of polyvinyl alcohol by weight. 18 parts of polyacrylamide.

[0013] Preferably, the special heat-conducting adhesive is characterized in that: the organic silica gel is a mixture of methyl silicone oil, methyl vinyl silicone ru...

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PUM

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Abstract

The invention relates to special heat conducting glue. The special heat conducting glue is prepared from, by weight, 10-20 parts of polyacrylate, 20-30 parts of organic silica gel, 20-30 parts of sodium silicate, 10-15 parts of heat conducting filler, 15-20 parts of polyvinyl alcohol and 10-18 parts of polyacrylamide. The special heat conducting glue is good in heat conductance, high in bonding capacity, resistant to abrasion and high temperature, good in stability, free of toxicity and environmentally friendly.

Description

technical field [0001] The invention relates to the field of interface heat dissipation materials, in particular to a special heat-conducting adhesive. Background technique [0002] With the increasing integration density of microelectronic devices, the heat dissipation requirements of microelectronic devices are also increasing. Therefore, it is of great significance to develop an interface heat dissipation material with high thermal conductivity. Due to its environmental friendliness and low cost, thermal conductive adhesives have gradually replaced traditional tin-lead solder interconnect materials. However, the development of traditional thermal adhesives also encountered some bottlenecks, such as low thermal conductivity, high density, and low stability. Contents of the invention [0003] The technical solution adopted by the present invention to solve the technical problem is to provide a special heat-conducting glue, which is characterized in that it includes polya...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J183/07C09J133/04C09J129/04C09J133/26C09J11/04
CPCC09J183/04C08L2201/08C08L2205/035C09J11/04C08L33/04C08L29/04C08L33/26C08K3/34C08K2003/282
Inventor 周淑华
Owner 周淑华