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Wafer-level packaging method for LED lamp bead used for display screen

A LED lamp bead and wafer-level packaging technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of LED device brightness attenuation, display color inconsistency, LED display brightness decline, etc., to ensure consistency, Increased concentration and low cost effects

Inactive Publication Date: 2016-09-14
CHANGZHI HONGYUAN PHOTOELECTRIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] After working for a long time, the brightness of the LED display will decrease and the color of the display will be inconsistent, mainly due to the brightness attenuation of the LED device.
The attenuation of LED brightness will cause the brightness of the whole screen to decrease

Method used

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Examples

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Effect test

Embodiment Construction

[0022] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be described clearly and completely in conjunction with specific embodiments. Obviously, the described embodiments are part of the embodiments of the present invention. Not all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0023] A wafer-level packaging method for LED lamp beads for display screens, comprising the steps of: putting into production, die bonding, wire bonding, dispensing, spectroscopy, and taping. When putting into production, the incoming chips are screened and then put into production in batches .

[0024] Specifically, the criteria for screening incoming chips are: the wavelength difference of the blue chip ...

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PUM

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Abstract

The invention provides a wafer-level packaging method for an LED lamp bead used for a display screen. The wafer-level packaging method comprises the steps of putting into production, die bonding, wire welding, adhesive dispensing, beam splitting and band braiding, wherein in the step of putting into production, the supplied material chips are screened and put into production in batches; the standard in screening the supplied material chips is as follows: the wavelength difference value of the blue chips of the same batch put into production is less than or equal to 5nm; the light intensity ratio of the blue chips of the same batch put into production is less than or equal to 1 to 1.5; the difference value of the standard difference of the blue chips of the same batch put into production is less than 2.5; the wavelength difference value of the green chips of the same batch put into production is less than or equal to 12nm; the light intensity ratio of the green chips of the same batch put into production is less than or equal to 1 to 1.4; and the difference value of the standard difference of the green chips of the same batch put into production is less than 3.5. The LED lamp bead produced by the method is relatively high in light color consistency, high in antistatic capability and can be widely applied to the LED packaging field for the display screen.

Description

Technical field [0001] The invention belongs to the technical field of LED packaging, and specifically relates to a wafer-level packaging method of LED lamp beads for display screens. Background technique [0002] LED display (LED display): A flat panel display composed of individual LED lamp beads, each of which is a pixel. The influence of LED lamp beads on LED display As the most expensive and most used component of LED display, LED lamp bead plays a leading role in the quality of LED display. The most critical component of a full-color LED display is LED lamp beads, for three reasons: [0003] First, LEDs are the most used key components in full-color screens, and thousands to tens of thousands of LEDs are used per square meter; [0004] Second, LED is the main body that determines the optical display performance of the entire screen, which directly affects the audience's evaluation of the display; [0005] Third, LED accounts for the largest proportion of the overall cost of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/58H01L33/52H01L33/00
CPCH01L33/005H01L33/52H01L33/58
Inventor 徐龙飞
Owner CHANGZHI HONGYUAN PHOTOELECTRIC TECH