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Preparation method of hexagonal boron nitride wrapped nanocopper particles

A hexagonal boron nitride and nano-copper technology, which is applied in nanotechnology, transportation and packaging, metal processing equipment, etc., can solve the problems of large thermal expansion coefficient, poor insulation, and poor molding process performance, and achieve good high temperature oxidation resistance. Excellent thermal conductivity, easy to control the effect of operation

Inactive Publication Date: 2016-10-12
JIANGSU UNIV
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

Thermally conductive materials are required to have the characteristics of low expansion coefficient, high thermal conductivity and high specific rigidity, while traditional thermally conductive materials such as copper, aluminum, and iron-titanium alloys have large thermal expansion coefficients and high densities, which cannot meet the requirements of modern development.
Moreover, the metal's corrosion resistance, poor insulation and poor forming process performance limit its application in these fields. Therefore, it is urgent to develop metals with excellent comprehensive properties such as light weight, corrosion resistance and easy molding in addition to high thermal conductivity. Processing and insulating materials

Method used

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  • Preparation method of hexagonal boron nitride wrapped nanocopper particles
  • Preparation method of hexagonal boron nitride wrapped nanocopper particles
  • Preparation method of hexagonal boron nitride wrapped nanocopper particles

Examples

Experimental program
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Effect test

Embodiment 1

[0025] Weigh 1 g of ammonium borate and 2 g of copper nitrate, mix and grind at room temperature for 10 minutes. Put it into a tube furnace for calcination, rise to 700°C at a heating rate of 1°C / min, and keep at 700°C for 1h. The product obtained after calcination is washed three times with ethanol and water respectively, and then put into a drying oven to dry to obtain a hexagonal boron nitride-coated nano-copper particle product. The boron nitride infrared characteristic peak of the product can be seen from the FTIR spectrum, which proves that the boron nitride is successfully prepared.

[0026] figure 1 It is the FTIR spectrogram of hexagonal boron nitride wrapped nano-copper particles and hexagonal boron nitride prepared in this embodiment. The boron nitride infrared characteristic peak of the product can be seen from the FTIR spectrum, which proves that the boron nitride is successfully prepared.

Embodiment 2

[0028] Weigh 1 g sodium borohydride and 3 g copper acetate respectively, mix and grind at room temperature for 10 minutes. Put it into a tube furnace for calcination, rise to 1200°C at a heating rate of 10°C / min, and keep at 1200°C for 5 hours. The product obtained after calcination is washed three times with ethanol and water respectively, and then put into a drying oven to dry to obtain a hexagonal boron nitride-coated nano-copper particle product. The characteristic peaks of boron nitride and metal elemental copper of the product can be seen from the XRD spectrum, which proves that the boron nitride and copper metal particles are successfully prepared.

[0029] figure 2 It is the XRD spectrum of the hexagonal boron nitride wrapped nano-copper particles prepared in this example, commercial boron nitride and hexagonal boron nitride. The characteristic peaks of boron nitride and metal copper of the product can be seen from the XRD spectrum, which proves that the boron nitri...

Embodiment 3

[0031] Weigh 1 g of potassium borohydride and 1.2 g of tetraammine copper chloride respectively, mix and grind at room temperature for 10 minutes. Put it into a tube furnace for calcination, rise to 900°C at a heating rate of 5°C / min, and keep at 900°C for 2h. The product obtained after calcination is washed three times with ethanol and water respectively, and then put into a drying oven to dry to obtain a hexagonal boron nitride-coated nano-copper particle product. It can be seen from the SEM spectrum that the hexagonal boron nitride completely wraps the metal copper particles, the thickness of the hexagonal boron nitride is ~10 nm, and the diameter of the nano-copper particles is 100-300 nm, which proves that the boron nitride-wrapped copper metal particles are successfully prepared.

[0032] image 3 It is the SEM photo of the hexagonal boron nitride wrapped nano-copper particles prepared in this embodiment. It can be seen from the SEM spectrum that the hexagonal boron ni...

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Abstract

The invention belongs to the technical field of preparation of nanometer materials, and in particular, relates to a method for preparing hexagonal boron nitride wrapped nanocopper particles. A hexagonal boron nitride precursor and a nanocopper particle precursor are mixed and grinded by a certain mol ratio, and are calcined at high temperature under nitrogen environment to prepare the hexagonal boron nitride wrapped nanocopper particles. The preparation method is cheap and easy-obtained in raw materials, low in cost and simple in operation; a prepared hexagonal boron nitride wrapped nanocopper composite material is excellent in heat conductivity, and has high-temperature oxidation resistance to enable the copper particles to stably exist in corrosive liquid or gas; and a hexagonal boron nitride shell protects the copper particles from being influenced by external environment.

Description

technical field [0001] The invention belongs to the technical field of nanomaterial preparation, specifically relates to the technical field of heat dissipation of electronic components, in particular to an inorganic composite metal nanoparticle material with high thermal conductivity, high mechanical strength and high temperature oxidation resistance. More specifically, it relates to a preparation based on a copper ammonium complex precursor, and a method of roasting the hexagonal boron nitride precursor mixture to obtain hexagonal boron nitride-wrapped copper particles. Background technique [0002] With the development of science and technology and the upgrading of industry, the integration, miniaturization, high frequency and light weight of electrical and electronic equipment are getting higher and higher. In order not to affect the performance, life and stability of the device, the heat dissipation of the equipment And anti-oxidation and corrosion put forward stricter ...

Claims

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Application Information

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IPC IPC(8): B22F9/20B22F1/02B82Y40/00
CPCB82Y40/00B22F9/20B22F1/16
Inventor 范东亮吕晓萌刘军冯金张素云谢吉民
Owner JIANGSU UNIV