Method for protecting surface of copper-aluminium composite cover plate
A technology of copper-aluminum composite and composite cover plate, which is applied in the field of hardware processing, can solve the problems of reduced electrical conductivity, influence of surface conductivity, and influence on the apparent performance of the cover plate, and achieves low production cost, good electrical conductivity, and smooth processing. simple effect
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[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0030] Please refer to the figure 1 To map 2 , The present invention is a surface protection method of a copper-aluminum composite cover plate, including:
[0031] 101. Stamping
[0032] The copper plate and the aluminum plate are punched and milled according to a predetermined shape to obtain a copper-aluminum composite cover plate to be processed, and the copper-aluminum composite cover plate contains a copper layer 1 And aluminum layer 2 。
[0033] Wherein, in the copper-aluminum composite cover plate to be processed, the content of copper is 0.05-50% , The content of aluminum is 0....
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