Method for protecting surface of copper-aluminium composite cover plate

A technology of copper-aluminum composite and composite cover plate, which is applied in the field of hardware processing, can solve the problems of reduced electrical conductivity, influence of surface conductivity, and influence on the apparent performance of the cover plate, and achieves low production cost, good electrical conductivity, and smooth processing. simple effect

Active Publication Date: 2016-10-12
SUZHOU XINTIANXIN HIGH PRECISION MECHANICAL CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a micron-scale polymer protective film is formed on the surface of the copper layer, the corrosion resistance of metallic copper can be significantly improved, but the electrical conductivity of the su

Method used

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  • Method for protecting surface of copper-aluminium composite cover plate
  • Method for protecting surface of copper-aluminium composite cover plate

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[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0030] Please refer to the figure 1 To map 2 , The present invention is a surface protection method of a copper-aluminum composite cover plate, including:

[0031] 101. Stamping

[0032] The copper plate and the aluminum plate are punched and milled according to a predetermined shape to obtain a copper-aluminum composite cover plate to be processed, and the copper-aluminum composite cover plate contains a copper layer 1 And aluminum layer 2 。

[0033] Wherein, in the copper-aluminum composite cover plate to be processed, the content of copper is 0.05-50% , The content of aluminum is 0....

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Abstract

The invention relates to the technical field of handware processing, and more specifically relates to a method for protecting a surface of a copper-aluminium composite cover plate. The method comprises the following steps: oil removing, polishing, primary protection and secondary protection, wherein the primary protection is characterized in that the polished copper aluminium composite cover plate is immersed into an oxidability protective solution, an uniform and compact inorganic protection film is simultaneously formed on the surface of a copper layer and an aluminium layer in the copper-aluminium composite cover plate; the secondary protection is characterized in that the copper-aluminium composite cover plate is immersed in a neutral protective solution, an uniform organic protection film is generated on the inorganic protection film on the copper layer; the cover plate processed by the protection method has good conductivity of the surface and has good corrosion resistance, work requirement of radio frequency communication can be satisfied, treatment processes are simple, and the production cost is low.

Description

technical field [0001] The invention relates to the technical field of hardware processing, in particular to a method for protecting the surface of a copper-aluminum composite cover plate. Background technique [0002] In mobile communication equipment, the cover plate is the main radio frequency communication structural part, and is widely used in core components such as filters, duplexers, combiners, and power dividers. In order to obtain good electrical conductivity, the cover plate is generally formed by forming an aluminum plate and then electroplated with silver to obtain good surface conductivity and stability. Although this method is widely used, the size of the cover plate will be affected during the electroplating process, and the process is complicated and the production cost is high. At the same time, it is difficult to control the quality during the electroplating process, and problems such as peeling off of the plating layer or uneven thickness often occur. T...

Claims

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Application Information

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IPC IPC(8): C23C22/48C23C22/68C23G1/14C23F3/00
CPCC23C22/48C23C22/68C23F3/00C23G1/14
Inventor 薛枫陈宁王勇
Owner SUZHOU XINTIANXIN HIGH PRECISION MECHANICAL CO LTD
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