A high-power LED integrated light source packaging method

Abstract

The invention discloses a packaging method for a high-power LED integrated light source. The method comprises: die bonding is carried out; (2), wire welding is carried out; (3), fluorescent powder is added; (4), dispensing and packaging are carried out; to be specific, a light-emitting part of an LED chip is coated with a fluorescent powder layer and a matching material for separation is arranged between the LED chip and the fluorescent powder layer; (5), baking and solidification are carried out; (6), testing is carried out; to be specific, a photoelectric parameter of the LED light source is tested and an appearance dimension is checked; (7), light and color sorting is carried out; to be specific, the LED light source is sorted based on a testing result and a user requirement; and (8), the product is packaged and is conveyed into a warehouse. Therefore, defects in the prior art are overcome. According to the packaging method, LED light source production can be carried out conveniently; the manufacturing process is simple and convenient; and the production efficiency is improved. Compared with the traditional high-power light source, the LED light source produced by using the method has the improved luminous efficacy and consistency and can be used for cooperation, so that a problem that the single light has insufficient illumination can be solved.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to a packaging method for high-power LED integrated light sources used in ceiling lamps. Background technique [0002] As far as the current situation is concerned, the power of a single LED tube on the market is usually around 1-5W, and the light output is only a few hundred lumens. In order for LEDs to be used in public places such as road lighting on a large scale, the luminous flux of LED light sources must reach thousands or even tens of thousands of lumens. Such a high light output cannot be achieved by a single chip. In order to meet such a high light output requirement, most of the light sources at home and abroad combine multiple LEDs (usually 1W) in one lamp to meet the requirements of high-brightness lighting. This method solves the problem of the brightness of a single light source to a certain extent. Insufficient problem. However, this process has the problems o...

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Problems solved by technology

[0003] In view of the above problems, the object of the present invention is to provide a high-power LED integrated light source packaging method, which overcomes the shortcomings of the prior art. The packaging method can conveniently carry out the production of LED light sources, the manufacturing process is simple and convenient, and the production efficiency is improved. Compared with the traditional high-power light source, the LED light source produced by this method has greatly improved light efficiency and consistency, and is suitable for combined use, so as to solve the problem of insufficient brightness of a single light source

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