Multi-layer flexible circuit board and preparation method thereof

A flexible circuit board and flexible substrate technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as wrinkles, defects, and poor wiring, and reduce corrosion and oxidation, reduce costs, and improve The effect of yield

Inactive Publication Date: 2016-10-12
双鸿电子(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ultra-thin materials are prone to wrinkles during the above-mentioned process, resulting in as many as 15% of circuit defects (including open circuit, sh

Method used

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  • Multi-layer flexible circuit board and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This embodiment provides a multi-layer flexible circuit board, which includes a flexible substrate 10 and a first metal layer 13 and a second metal layer 14 arranged in sequence on the back of the flexible substrate; five conductive layers 11 and 12; through holes 20 are provided in the flexible substrate, and the through holes are formed by punching holes along the thickness direction of the back surface of the substrate; the conductive layer on the upper layer is formed by hot melt adhesive coated on the surface of the upper conductive layer The layer is connected with the conductive layer of the lower layer; the conductive layer of the lowermost layer is connected to the flexible substrate through the hot melt adhesive layer coated on the surface of the conductive layer of the lowermost layer; the conductive layer except the uppermost layer is printed with a circuit layer .

[0027] The circuit layer and the hot-melt adhesive layer are respectively disposed on the su...

Embodiment 2

[0041] This embodiment provides a multi-layer flexible circuit board, the multi-layer flexible circuit board includes a flexible substrate, a first metal layer and a second metal layer arranged in sequence on the back of the flexible substrate; three conductive layers are arranged on the front of the flexible substrate; The flexible substrate is provided with through holes, and the through holes are formed by drilling through holes along the thickness direction of the back surface of the substrate; the conductive layer on the upper layer is connected to the conductive layer on the lower layer through a hot melt adhesive layer coated on the surface of the upper conductive layer. ; The lowermost conductive layer is connected with the flexible substrate via a hot melt adhesive layer coated on the surface of the lowermost conductive layer; a circuit layer is printed on the conductive layers except the uppermost layer.

[0042] The circuit layer and the hot-melt adhesive layer are r...

Embodiment 3

[0056] This embodiment provides a multi-layer flexible circuit board, the multi-layer flexible circuit board includes a flexible substrate, a first metal layer and a second metal layer arranged in sequence on the back of the flexible substrate; four conductive layers are arranged on the front of the flexible substrate There are through holes in the flexible substrate, and the through holes are formed by punching holes along the thickness direction of the back of the substrate; connection; the lowermost conductive layer is connected with the flexible substrate through a hot melt adhesive layer coated on the surface of the lowermost conductive layer; a circuit layer is printed on the conductive layers except the uppermost layer.

[0057] The circuit layer and the hot-melt adhesive layer are respectively arranged on the surfaces of both sides of the conductive layer; the thickness of the hot-melt adhesive layer is 0.6 mm, and the thickness of the circuit layer is 0.3 mm.

[0058]...

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Abstract

The invention provides a multi-layer flexible circuit board comprising a flexible substrate, a first metal layer, and a second metal layer. The first metal layer and the second metal layer are arranged successively on the back of the flexible substrate. At least three conducting layers are arranged on the front side of the flexible substrate. A through hole is formed in the flexible substrate and is formed by carrying out punching on the substrate along a substrate back thickness direction. The conducting layer at the upper layer is connected with the conducting layer at the lower layer by a hot melt adhesive layer coated on the surface of the conducting layer at the upper layer; the conducting layer at the bottom is connected with the flexible substrate by a hot melt adhesive layer coated on the surface of the conducting layer at the bottom. A circuit diagram layer is printed on the conducting layers except the conducting layer on the top.

Description

technical field [0001] The invention relates to the field of a multi-layer flexible circuit board and a manufacturing process thereof, and more particularly, the improvement relates to a multi-layer flexible circuit board and a preparation method thereof. Background technique [0002] Flexible circuit board, also known as flexible circuit board, flexible printed circuit board, flexible circuit board, referred to as FPC (Flexible Printed Circuit), has the characteristics of high wiring density, light weight and thin thickness. FPC refers to a single-layer, double-layer or multi-layer printed circuit board made of a flexible substrate, which can have a cover layer (solder mask layer) or no cover layer (solder mask layer). According to the number of layers of conductive copper foil, flexible circuit boards can be divided into single-layer boards, double-layer boards, multi-layer boards, double-sided boards, etc. [0003] The conductive copper foil needs to be etched to obtain ...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/028H05K1/0298H05K3/4635H05K2203/052
Inventor 陈江波胡清池
Owner 双鸿电子(惠州)有限公司
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