Two-component polyurethane adhesive for electronic potting and preparation method thereof
A two-component polyurethane and adhesive technology, applied in the field of polyurethane, to achieve the effect of low viscosity and good flexibility
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Embodiment 1
[0020] Preparation of component A: Add 20g of castor oil, 180g of polyether polyol PPG4000, and 0.2g of defoamer MOK6021 into the reaction kettle, heat to 90-110°C, vacuum dehydrate for 1 hour, then cool down to 60°C and add MDI- 50 205g, react under nitrogen protection for 3 hours, cool down to normal temperature, add 200g of flame retardant tricresyl phosphate, and seal the package.
[0021] Preparation of component B: Add 100g of polyether polyol PPG 1000, 40g of polyether polyol PEG800, 5g of crosslinking agent TMP, 0.5g of catalyst T-12, and 30g of plasticizer Eastman 168 into the reactor, and heat to 80°C , dehydrated in vacuum for 3 hours, then cooled down to room temperature under nitrogen protection, and sealed and packaged.
[0022] Mix component A and component B uniformly at a weight ratio of 1:1, and place it at 60°C for 1 hour to obtain the finished product.
[0023] When in use, the uniformly mixed glue is poured into the dry electronic components, and then pla...
Embodiment 2
[0025] Preparation of component A: Add 50 g of castor oil, 150 g of trifunctional polyether polyol polyoxypropylene triol, and 0.4 g of defoamer MOK6021 into the reaction kettle, heat to 90-110 °C, and vacuum dehydrate for 1 hour. After cooling down to 60°C, add 225g of MDI, react under nitrogen protection for 3 hours, cool down to normal temperature, add 200g of flame retardant tributyl phosphate, and seal the package.
[0026] Preparation of component B: Add 120g of polyether polyol PPG 2000, 20g of polyether polyol PEG400, 7g of crosslinking agent TMP, 1g of catalyst T-9, and 35g of plasticizer Benzoflex 9-88 into the reaction kettle, heat to 80 ℃, vacuum dehydration for 3 hours, and then cooled down to room temperature under the protection of nitrogen, and sealed and packaged.
[0027] Mix component A and component B uniformly at a weight ratio of 1:1, and place it at 60°C for 1 hour to obtain the finished product.
[0028] When in use, the uniformly mixed glue is poured ...
Embodiment 3
[0030] Preparation of component A: Add 80g of castor oil, 120g of polyether polyol PPG1000, and 0.5g of defoamer MOK6021 into the reaction kettle, heat to 90-110°C, vacuum dehydrate for 1 hour, then cool down to 60°C and add MDI- 50 275g, react under nitrogen protection for 3 hours, cool down to normal temperature, add 222g of flame retardant tricumyl phosphate, and seal the package.
[0031] Preparation of component B: Add polyether polyol PPG 2000 80g, polyether polyol PEG2000 120g, crosslinking agent 1,4-butanediol 10g, catalyst T-12 0.3g, plasticizer Eastman 168 80g to the reaction In the kettle, heat to 80°C, vacuum dehydrate for 3 hours, then cool down to normal temperature under the protection of nitrogen, and seal the package.
[0032] Mix component A and component B uniformly at a weight ratio of 1:1, and place it at 60°C for 1 hour to obtain the finished product.
[0033] When in use, the uniformly mixed glue is poured into the dry electronic components, and then pl...
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