Manufacture method for device chips
A device chip and manufacturing method technology, which is applied in the field of device chip manufacturing, can solve the problems of increasing the number of predetermined dividing lines and taking a long time for processing, and achieve the effect of shortening the time.
Inactive Publication Date: 2016-11-09
DISCO CORP
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Problems solved by technology
Especially in the case of small device chips (for example, 5mm or less), the number of dividing lines increases and processing takes a long time
Method used
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[0026] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The manufacturing method of the device chip of the present embodiment includes a groove forming step (refer to figure 1 ), grinding steps (refer to figure 2 , image 3 (A) and image 3 (B)), adhesive coating step (refer to Figure 4 (A) and Figure 4 (B)) and the hardening step (see Figure 5 ).
[0027] In the groove forming step, grooves along planned dividing lines are formed on the front side of the wafer. In the grinding step, a protective member is attached to the front surface of the wafer, and the back surface is ground so that grooves are exposed on the back surface side, and the wafer is divided into device chips. In the adhesive application step, the liquid adhesive for die bonding is applied by spraying onto the back surface of the wafer. In the hardening step, the applied liquid die bonding adhesive is hardened. Hereinafter, the method of manufactur...
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The invention provides a manufacture method for device chips. The method can shorten time needed by formation of a bonding layer. The manufacture method for the device chips is characterized in that wafers (11) which comprise devices (13) in areas of the front face (11a) side divided by multiple segmentation preset lines are used to manufacture the multiple device chips (17) corresponding to the devices. The method comprises the steps including groove formation, grinding, bonding agent coating and hardening, wherein during the groove formation, grooves (15) of which the depth is equal to the finished product thickness of the device chips are formed on the front face side of the wafers along the segmentation preset lines; during the grinding, protective components (21) are attached on the front faces of the wafers, the back faces of the wafers are grinded, the grooves can then be exposed from the back face side, and the wafers are segmented into the device chips; during the bonding agent coating, a bonding agent (23) of a liquid state used for tube core welding is sprayed and coated on the back faces of the segmented wafers after the step of grinding; and during the hardening, the bonding agent of the liquid state used for the tube core welding is hardened after completion of the step of bonding agent coating.
Description
technical field [0001] The present invention relates to a method of manufacturing a device chip by dividing a wafer having a plurality of devices to manufacture device chips corresponding to the respective devices. Background technique [0002] A wafer having a plurality of devices formed on the front side is cut by a cutting tool along, for example, a planned dividing line (dicing line), and divided into a plurality of device chips corresponding to each device. In order to fix such a device chip to another substrate or the like, an adhesive layer for fixing is sometimes provided on the back side of the device chip. [0003] The adhesive layer provided on the back side is closely adhered to a substrate or the like to be fixed, and external stimuli such as heat and light are applied to harden the adhesive layer to fix the device chip. As the adhesive layer, for example, a film-like adhesive for die bonding called a die attach film (DAF: Die Attach Film) or the like can be us...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/78H01L21/02
CPCH01L21/02104H01L21/78H01L21/76H01L21/304H01L21/30625H01L21/52
Inventor 杉谷哲一灰本隆志小清水秀辉荒谷侑里香
Owner DISCO CORP