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Method for manufacturing printed circuit board (pcb)

A printed circuit board, conductive pattern technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problems of blistering, aluminum pattern falling off, etc.

Inactive Publication Date: 2016-12-07
HYUNDAI MOTOR CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, a disadvantage of the conventional inkcoating method is that the aluminum pattern can come off or blisters can occur

Method used

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  • Method for manufacturing printed circuit board (pcb)
  • Method for manufacturing printed circuit board (pcb)
  • Method for manufacturing printed circuit board (pcb)

Examples

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Embodiment Construction

[0033] Reference will now be made in detail to embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

[0034] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that when used in this specification, the terms "comprising" and / or "comprising" refer to the presence of stated features, integers, steps, operations, elements and / or components, but do not exclude one or more other The presence or addition of features, integers, steps, operations, elements, components and / or combinations thereof. As used herein, the term "and / or" includes any and all combinat...

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PUM

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Abstract

A method for forming a printed circuit board (PCB) includes: depositing, a first time, a photo imageable solder resist (PSR) ink over a top surface and a bottom surface of the PCB including a conductive pattern; drying, a first time, the PCB on which the PSR ink has been deposited for the first time; depositing, a second time, the PSR ink over the top surface and the bottom surface of the PCB; and drying, a second time, the PCB on which the PSR ink has been deposited for the second time.

Description

technical field [0001] The present invention relates to a method of manufacturing a printed circuit board (Printed circuit board, PCB), and more particularly, to a technique of depositing photo imageable solder resist (Photo imageable Solder Resist, PSR) to the PCB. Background technique [0002] One disadvantage of common printed circuit boards (PCBs) used in vehicles is that the internal heat flow characteristics may be deteriorated. In order to overcome the phenomenon of poor internal heat flow, the method of increasing heat dissipation by inserting metal materials into the PCB has been widely used. Copper (Cu) pattern (Pattern) has been used to increase heat dissipation, but the cost of the product increases due to the increase in the cost of copper raw materials. In order to solve the above cost problem, circuit patterns have been made of cheap aluminum (Al). [0003] Aluminum (Al) has lower electrical conductivity than copper (Cu), and thus, aluminum (Al) requires a l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10
CPCH05K3/28H05K2203/0588H05K2203/1476
Inventor 高亨根金文钟崔良鈗朴炅全黄琄泽
Owner HYUNDAI MOTOR CO LTD