An fpga-based wafer detection signal extraction device and system
A technology for detecting signals and extracting devices, which is applied in the direction of optical testing flaws/defects, etc. It can solve the problems of analog signal extraction and processing methods that have not yet appeared, and achieve the effects of stable processing, improved processing efficiency, and stable data processing
Active Publication Date: 2019-04-16
中国科学院嘉兴微电子仪器与设备工程中心
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Problems solved by technology
Since the scattered light is very weak when the size of the contamination on the wafer is small, how to improve the detection sensitivity is the main challenge of this method
The main principle of the current wafer inspection method and wafer inspection device is to use the light spots with periodic distribution of synthetic light intensity to realize the periodic modulation of the scattered signal, so that the signal is concentrated to a specific frequency, because the system noise is nearly uniform in the wide spectrum Distribution, by performing signal analysis around a specific frequency to eliminate the influence of part of the noise to improve sensitivity, but the analog signal extraction and processing methods for wafer inspection devices have not yet appeared
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[0036] The embodiment of the present invention improves the extraction efficiency of the analog signal detected by the wafer detection device by providing an FPGA-based wafer detection signal extraction device and system, and the processing of the extracted wafer signal is more stable and sensitive, ensuring Accuracy of Data Processing.
[0037] see figure 1 , the embodiment of the present invention provides an FPGA-based wafer detection signal extraction device, including:
[0038] The signal acquisition unit is used for collecting the wafer detection analog signal and converting the wafer detection analog signal into a digital signal. Wherein, the signal acquisition unit includes: an analog signal acquisition module and an analog-to-digital conversion module. The analog signal collection module is used for collecting the wafer detection analog signal from the wafer detection device. The analog-to-digital conversion module is used to convert the wafer detection analog sign...
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The invention relates to the technical field of wafer detection, and especially relates to an extraction apparatus of wafer detection signals based on FPGA. The apparatus comprises the following components: a signal acquisition unit, which is used for acquisition of wafer detection analog signals, and converting wafer detection analog signals into data signals; a data extraction unit, which is used for storing data in data signals in a buffer area according to a timing sequence; a processing unit, which is used for using data in the buffer area and carrying out time domain processing and frequency domain processing for data in the buffer area; and a judging unit, which is used for searching time domain signals and frequency domain signals, coalition of the time domain signals and frequency domain signals, judging the signals, and uploading the signals to a host computer. An embodiment of the invention provides the extraction apparatus and a system of wafer detection signals, so that extraction efficiency of analog signals which are detected by a wafer detection apparatus is improved, and data processing in extraction of wafer signals is more stable and accurate.
Description
technical field [0001] The invention relates to the technical field of wafer detection, in particular to an FPGA-based wafer detection signal extraction device and system. Background technique [0002] Wafer growth is the foundation of the semiconductor industry. Due to the influence of materials, equipment, and environmental factors, particle contamination will inevitably occur on the surface of the wafer. Therefore, how to ensure the quality of the wafer by detecting the number and density of particle contamination Normal growth has become a key link. The scanning detection method using light scattering has the advantages of fast speed and no additional pollution, and is currently the main method for comprehensive wafer detection in the semiconductor industry. Its basic principle is to use a small spot to irradiate the wafer surface with oblique incidence. Since the wafer surface is very smooth, when there is no pollution at the spot where the spot is irradiated, all the ...
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IPC IPC(8): G01N21/94
CPCG01N21/94
Inventor 陈鲁马砚忠刘虹遥张朝前杨乐路鑫超
Owner 中国科学院嘉兴微电子仪器与设备工程中心