Resin composition for molding underfill
A resin composition and underfill technology, applied in the direction of semiconductor/solid-state device parts, circuits, electric solid-state devices, etc., to achieve the effects of suppressing warpage, suppressing delamination, and excellent filling.
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preparation example Construction
[0157]
[0158] The resin composition for molding underfill of the present invention can be prepared by mixing the above-mentioned components appropriately, and using a kneading device such as a three-roll mill, a ball mill, a bead mill, or a sand mill, or a high-speed mixer or a planetary mixer as needed. Prepare by kneading or mixing with stirring equipment.
[0159]
Embodiment
[0164] The following synthesis examples, examples, and comparative examples are given to describe the present invention in more detail. However, the present invention is not limited to the following synthesis examples, and of course can be appropriately modified within the scope of the above-mentioned and following principles. implementation, they are all included in the technical scope of the present invention. In addition, "%" and "part" described below refer to "mass %" and "mass part" unless otherwise mentioned.
[0165] The "equivalent" described below is the number of grams (g / eq) of a compound containing 1 gram equivalent of a functional group. In other words, the "equivalent" described below refers to a value obtained by dividing the molecular weight of a compound having a functional group to be equivalent by the number of functional groups the compound has, that is, the molecular weight per functional group. For example, the acid anhydride equivalent is a value obtai...
Synthetic example 1
[0166] Synthesis Example 1: Production of Polymer Resin A1 Varnish
[0167] (2-functional hydroxyl-terminated polybutadiene (number average molecular weight: 5,047 (GPC method), hydroxyl equivalent: 1798 g / eq, solid content: 100%, "G-3000" manufactured by Nippon Soda Co., Ltd.) ”) 50 g, (aromatic hydrocarbon-based mixed solvent (boiling point: 184 to 205° C., Idemitsu Petrochemical Co., Ltd. “IPZOL 150”) 23.5 g, and dibutyltin laurate 0.005 g were mixed and dissolved uniformly. After the mixture became uniform, the temperature was raised to 50°C, and 4.8 g of toluene-2,4-diisocyanate (isocyanate group equivalent: 87.08 g / eq) was added while stirring, and the reaction was carried out for about 3 hours. Next, the reactant After cooling to room temperature, 8.96 g of benzophenone tetracarboxylic dianhydride (acid anhydride equivalent: 161.1 g / eq), 0.07 g of triethylenediamine, and diethylene glycol monoethyl ether acetate (boiling point : 217°C, 40.4g of "ethyldiglycol acetate" ...
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Abstract
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